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DS8907N

Texas Instruments

DS8907N by Texas Instruments

DS8907N by Texas Instruments is a PLL Frequency Synthesizer with 20 terminals, operating at 5V. It has a rectangular package style, suitable for commercial applications. With a temperature range of 0-70°C and max supply current of 160mA, it offers precise frequency synthesis in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 3,523 parts In-Stock

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Anansix

USA . 1,194 parts In-Stock

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Digiode

USA . 966 parts In-Stock

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Eagle Technology Solutions

USA . 21 parts In-Stock

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R&J Components

USA . 5 parts In-Stock

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Electronic Expediters

USA . 2 parts In-Stock

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Native Components

USA . 352 parts In-Stock

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$0.526

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Northwest PG Solutions

USA . 2,367 parts In-Stock

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$0.579

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One Stop Electronics

USA . 429 parts In-Stock

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$3.500

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Parana Technologies

USA . 49 parts In-Stock

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$5.209

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$5.822

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ChromeModa Solutions

Germany . 2,286 parts In-Stock

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$5.853

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$4.799

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

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$5.853

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$5.268

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AZTECH Wire

Italy . 290 parts In-Stock

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$6.269

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DigiPath Technology Company

USA . 2,269 parts In-Stock

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Corphita

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Overview

Experience superior performance and reliability with the DS8907N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality in their Phase Locked Loops (PLL) & Frequency Synthesis Circuits. The DS8907N offers unparalleled precision and efficiency in various applications, making it the ideal choice for your electronic projects. With its innovative design and advanced features, this product provides unmatched value and benefits to customers seeking exceptional performance. Trust Texas Instruments for top-of-the-line solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good thermal stability and high reliability, making the product suitable for a wide range of operating temperatures.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is commonly used in many electronic devices, ensuring compatibility with a variety of systems.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and integration in complex circuit designs.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance even under demanding environmental conditions.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, the product can operate efficiently even with slightly lower power sources.

Maximum Supply Current (Isup): 160 mA

The maximum supply current of 160mA indicates efficient power consumption, making the product energy-efficient.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits DS8907N attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5V TO 6V SUPPLY

Other IC type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

Length:

26.0731 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

160 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

DS8907N Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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