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DS3875V

Texas Instruments

DS3875V by Texas Instruments

DS3875V by Texas Instruments is a System Interface Logic IC with 68 terminals, CMOS technology, and 5.5V max supply voltage. It is used as a bus arbiter and signal generator in commercial-grade applications requiring precise logic interfacing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,469 parts In-Stock

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8,469

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Digiode

USA . 4,175 parts In-Stock

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4,175

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Anansix

USA . 1,708 parts In-Stock

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4 Star Electronics, Inc.

USA . 110 parts In-Stock

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110

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Native Components

USA . 645 parts In-Stock

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$6.175

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645

$6.175

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One Stop Electronics

USA . 360 parts In-Stock

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$17.000

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360

$17.000

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AZTECH Wire

Italy . 873 parts In-Stock

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$17.729

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873

$17.729

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Parana Technologies

USA . 1,421 parts In-Stock

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$75.934

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$75.934

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DigiPath Technology Company

USA . 1,300 parts In-Stock

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$83.613

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$76.924

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$83.613

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ChromeModa Solutions

Germany . 124 parts In-Stock

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$85.319

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$69.962

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124

$85.319

$69.962

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IDEA Electronic Components Group

UK . 71 parts In-Stock

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$85.319

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$81.053

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$76.787

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71

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Corohmni

South Africa . 602 parts In-Stock

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$85.397

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Northwest PG Solutions

USA . 1,621 parts In-Stock

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$6.052

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Corphita

USA . 365 parts In-Stock

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365

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Overview

Experience unparalleled performance and reliability with the Texas Instruments DS3875V, a cutting-edge System Interface Logic IC. Crafted by industry leader Texas Instruments, this chip carrier package boasts a wide operating temperature range and superior build quality for seamless integration into various applications. From bus arbiters to continuous signal generators, this commercial-grade IC delivers unmatched value and efficiency to customers seeking top-notch system interface solutions. Elevate your projects with the DS3875V and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate into electronic circuits, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance allows the product to work reliably within a wide range of voltage inputs.

Package Shape: SQUARE

The square package shape simplifies PCB layout design and allows for efficient use of space within the electronic system.

No. of Terminals: 68

Having 68 terminals provides ample connectivity options, allowing for versatile integration with other components in the system.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product operates efficiently within standard environmental conditions, suitable for most commercial applications.

Technical Specifications

System Interface Logic ICs DS3875V attributes and parameters. Explore more System Interface Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J68

Length:

25.13 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

25.13 mm

Trade Compliance

DS3875V Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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