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DS25CP102EVK/NOPB

Texas Instruments

DS25CP102EVK/NOPB by Texas Instruments

DS25CP102EVK/NOPB by Texas Instruments is an Interface Evaluation Board for LVDS applications. It features a Crosspoint Switch/Multiplexer function, utilizing DS25CP102TSQ/X ICs. The package includes board(s) and has Moisture Sensitivity Level of 1 (Unlimited), making it suitable for Development Boards, Kits, and Programmers.

Median Price

$199.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11 parts In-Stock

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$199.000

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11

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Digiode

USA . 3,726 parts In-Stock

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$189.050

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3,726

$189.050

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Vyrian

USA . 2,407 parts In-Stock

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2,407

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Distributors (Availability)

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Native Components

USA . 5 parts In-Stock

1+ parts

$0.497

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5

$0.497

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Northwest PG Solutions

USA . 2,314 parts In-Stock

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$0.547

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$0.482

2,314

$0.547

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$0.482

Semicontronic

India . 7 parts In-Stock

1+ parts

$169.150

100+ parts

$164.921

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$164.076

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7

$169.150

$164.921

$164.076

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Corphita

USA . 4,409 parts In-Stock

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$179.100

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4,409

$179.100

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Corohmni

South Africa . 212 parts In-Stock

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$199.000

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212

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$368.150

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7

$368.150

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ChromeModa Solutions

Germany . 4,947 parts In-Stock

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4,947

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Parana Technologies

USA . 2,255 parts In-Stock

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$0.340

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2,255

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$0.340

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IDEA Electronic Components Group

UK . 1,347 parts In-Stock

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1,347

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DigiPath Technology Company

USA . 1,333 parts In-Stock

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1,333

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Overview

Unlock the full potential of your LVDS applications with the DS25CP102EVK/NOPB by Texas Instruments. This development board offers unparalleled quality and reliability, backed by the trusted reputation of Texas Instruments. Ideal for interface applications, this kit provides a seamless experience for engineers looking to optimize their designs. Experience the value and benefits of this versatile solution, designed to streamline your development process and deliver exceptional results.

Feature Benefit Bullets

Other Names: DS25CP102EVK, DS25CP102EVKNOPB, 296-DS25CP102EVK/NOPB, DS25CP102EVK-ND, DS25CP102EVK/NOPB-ND

Having multiple names and references makes it easier to find and order the product from different sources.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

This product is versatile and can be used for development, evaluation, and demonstration purposes, making it suitable for various applications.

Package: Box

The product comes in a protective package box, ensuring safe transportation and storage.

Type: Interface

Being an interface device, this product facilitates communication between different components or systems.

Function: LVDS, Crosspoint Switch/Multiplexer

With the capability to handle LVDS signals and act as a crosspoint switch or multiplexer, this product is ideal for applications requiring data routing and signal processing.

Utilized IC / Part: DS25CP102TSQ, DS25CP102TSQX

The use of specific integrated circuits ensures compatibility and optimal performance with the designated components.

Supplied Contents: Board(s)

The product includes the necessary board(s) for operation, reducing the need for additional components and simplifying setup.

Base Product Number: DS25CP102

This product is based on the DS25CP102 model, known for its reliability and performance in signal processing applications.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The product can withstand various environmental conditions, including moisture, ensuring durability and longevity.

Technical Specifications

Additional Parts DS25CP102EVK/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DS25CP102EVK
DS25CP102EVKNOPB
296-DS25CP102EVK/NOPB
DS25CP102EVK-ND
DS25CP102EVK/NOPB-ND

Function:

LVDS, Crosspoint Switch/Multiplexer

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

DS25CP102TSQ, DS25CP102TSQX

Package:

Box

Standard Package:

1

Base Product Number:

DS25CP102

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DS25CP102EVK/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991B1

HTS

8543.70.9860

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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