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DS125BR800AEVM

Texas Instruments

DS125BR800AEVM by Texas Instruments

DS125BR800AEVM by Texas Instruments is an 8-channel cable equalizer interface board with SMA connectors. It is used for evaluating the DS125BR800A IC, offering unlimited moisture sensitivity level. This development kit is ideal for testing and demonstrating high-speed signal transmission capabilities in various applications.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 6,408 parts In-Stock

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Digiode

USA . 614 parts In-Stock

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Native Components

USA . 162 parts In-Stock

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$9.500

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Northwest PG Solutions

USA . 524 parts In-Stock

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$10.450

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$9.405

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Ampacity Inc.

Singapore . 1,614 parts In-Stock

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$13.100

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AZTECH Wire

Italy . 777 parts In-Stock

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Semicontronic

India . 1,128 parts In-Stock

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$176.100

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$171.698

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$170.817

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One Stop Electronics

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ChromeModa Solutions

Germany . 6,828 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 2,368 parts In-Stock

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IDEA Electronic Components Group

UK . 1,534 parts In-Stock

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Parana Technologies

USA . 1,173 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Component Stockers USA

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Perfect Parts

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Overview

Enhance your interface design with the Texas Instruments DS125BR800AEVM evaluation board. Crafted by a trusted industry leader, this 8-channel cable equalizer offers unparalleled performance and reliability. Ideal for development projects, this board comes complete with SMA connectors for seamless integration. Experience the value of precise signal transmission and unlock new possibilities in your applications with the DS125BR800AEVM. Elevate your designs with Texas Instruments.

Feature Benefit Bullets

Other Names: 296-37206

Easy to identify and locate product in inventory or when ordering for convenience.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

Versatile product that can be used for development and evaluation purposes in various applications.

Package: Box

Protects the contents of the product during shipping and storage, ensuring it arrives in good condition.

Type: Interface

Provides a convenient interface for connecting the product to other devices or components.

Function: Cable Equalizer

Helps in maintaining signal integrity over longer cable lengths, ensuring reliable communication.

Utilized IC / Part: DS125BR800A

High-quality and reliable IC/part known for its performance and functionality.

Primary Attributes: 8-Channel (Octal)

Allows for multiple channels to be processed simultaneously, increasing efficiency and throughput.

Supplied Contents: Board(s)

Includes necessary board(s) for immediate use, saving time and effort in sourcing additional components.

Secondary Attributes: SMA Connectors

Compatible with standard SMA connectors, making it easy to integrate with existing setups.

Base Product Number: DS125BR800

Built upon a reliable base product known for its quality and performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and handled without special precautions related to moisture, making it easy to use in various environments.

Technical Specifications

Additional Parts DS125BR800AEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-37206

Function:

Cable Equalizer

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Secondary Attributes:

SMA Connectors

Utilized IC / Part:

DS125BR800A

Package:

Box

Primary Attributes:

8-Channel (Octal)

Standard Package:

1

Base Product Number:

DS125BR800

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DS125BR800AEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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