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DS10BR150EVK/NOPB

Texas Instruments

DS10BR150EVK/NOPB by Texas Instruments

DS10BR150EVK/NOPB by Texas Instruments is an LVDS Buffer/Repeater interface board. It features DS10BR150 IC, MSL level 1, and comes in a box package. Ideal for evaluating and demonstrating LVDS signal transmission in various applications.

Median Price

$163.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 12 parts In-Stock

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$149.000

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12

$149.000

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DigiKey

USA . 1 parts In-Stock

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$178.800

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1

$178.800

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Digiode

USA . 2,556 parts In-Stock

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$141.550

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2,556

$141.550

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Vyrian

USA . 6,946 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 802 parts In-Stock

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$18.290

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802

$18.290

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Northwest PG Solutions

USA . 2,259 parts In-Stock

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$20.119

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$18.107

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2,259

$20.119

$18.107

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Ampacity Inc.

Singapore . 5 parts In-Stock

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$126.650

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5

$126.650

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Semicontronic

India . 5 parts In-Stock

1+ parts

$126.650

100+ parts

$123.484

1k+ parts

$122.850

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5

$126.650

$123.484

$122.850

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Corphita

USA . 3,438 parts In-Stock

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$134.100

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3,438

$134.100

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Corohmni

South Africa . 184 parts In-Stock

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$149.000

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184

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ChromeModa Solutions

Germany . 2,437 parts In-Stock

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DigiPath Technology Company

USA . 1,216 parts In-Stock

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IDEA Electronic Components Group

UK . 850 parts In-Stock

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850

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Parana Technologies

USA . 37 parts In-Stock

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$0.859

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37

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$0.859

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Discover the power of Texas Instruments with the DS10BR150EVK/NOPB evaluation kit. This kit offers high-quality development boards and kits for LVDS buffer/repeater applications. With Texas Instruments' reputation for excellence, you can trust in the reliability and performance of this interface solution. Whether you are designing for industrial, automotive, or communication applications, this kit provides value, benefits, and advantages that will take your projects to the next level. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Other Names: DS10BR150EVKNOPB, DS10BR150EVK-ND

These additional names make it easy to identify and order this product from various sources.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

This product falls under multiple categories, indicating its versatility and potential applications.

Package: Box

The product comes in a convenient box packaging, making it easy to store and transport.

Type: Interface

As an interface device, this product allows for seamless communication and connectivity between different systems.

Function: LVDS, Buffer/Repeater

By serving as a LVDS buffer/repeater, this product enhances signal strength and integrity in a communication system.

Utilized IC / Part: DS10BR150

The use of DS10BR150 IC ensures high-quality performance and compatibility with various systems.

Supplied Contents: Board(s)

The product includes the necessary board(s) for evaluation and testing, providing a complete solution.

Base Product Number: DS10BR150

This product is based on the DS10BR150, a reliable and well-known component in the industry.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With a moisture sensitivity level of 1 (unlimited), this product can be stored and used in various environmental conditions without risk of damage.

Technical Specifications

Additional Parts DS10BR150EVK/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DS10BR150EVKNOPB
DS10BR150EVK-ND
DS10BR150EVK

Function:

LVDS, Buffer/Repeater

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

DS10BR150

Package:

Box

Standard Package:

1

Base Product Number:

DS10BR150

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DS10BR150EVK/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991B1

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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