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DRV2667EVM-CT

Texas Instruments

DRV2667EVM-CT by Texas Instruments

DRV2667EVM-CT by Texas Instruments is an Evaluation Board for DRV2667 motor controller/driver with embedded 16-bit MCU. It features I2C interface, suitable for haptic/vibration applications. The package includes board(s) and cable(s), making it ideal for power management development projects.

Median Price

$149.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 22 parts In-Stock

1+ parts

$85.360

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22

$85.360

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Newark

USA . 22 parts In-Stock

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$137.240

100+ parts

$118.370

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$137.240

$118.370

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Texas Instruments

USA . 2 parts In-Stock

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$149.000

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2

$149.000

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Element14

Singapore . 22 parts In-Stock

1+ parts

$157.600

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22

$157.600

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DigiKey

USA . 10 parts In-Stock

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$178.800

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10

$178.800

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Distributors (In-Stock)

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Digiode

USA . 3,296 parts In-Stock

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$141.550

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3,296

$141.550

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Vyrian

USA . 4,363 parts In-Stock

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4,363

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8 parts In-Stock

1+ parts

$126.650

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8

$126.650

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Semicontronic

India . 8 parts In-Stock

1+ parts

$126.650

100+ parts

$123.484

1k+ parts

$122.850

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8

$126.650

$123.484

$122.850

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Corphita

USA . 1,335 parts In-Stock

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$134.100

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1,335

$134.100

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Corohmni

South Africa . 140 parts In-Stock

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$149.000

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140

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ChromeModa Solutions

Germany . 2,575 parts In-Stock

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2,575

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IDEA Electronic Components Group

UK . 2,279 parts In-Stock

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2,279

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Northwest PG Solutions

USA . 2,228 parts In-Stock

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$3.450

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2,228

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$3.450

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DigiPath Technology Company

USA . 1,496 parts In-Stock

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1,496

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Parana Technologies

USA . 820 parts In-Stock

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$1.311

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820

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$1.311

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Native Components

USA . 630 parts In-Stock

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$3.415

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630

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$3.415

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Perfect Parts

USA . 2 parts In-Stock

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2

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Overview

Experience the ultimate in haptic feedback with the DRV2667EVM-CT by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers a versatile motor controller/driver that is perfect for a wide range of applications. Whether you're looking to enhance user experiences in consumer electronics or industrial equipment, this embedded MCU-based solution offers seamless integration and unmatched performance. Elevate your product's tactile feedback with the DRV2667EVM-CT and give your customers an unforgettable sensory experience.

Feature Benefit Bullets

Other Names: 296-35763

Easy to identify and locate in inventory.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Provides a wide range of functionalities for development and testing purposes.

Package: Box

Helps in organizing and storing the components securely.

Type: Power Management

Efficiently manages power for motor control and haptic/vibration functions.

Function: Motor Controller/Driver, Haptic/Vibration

Specifically designed for controlling motors and producing haptic feedback.

Embedded: Yes, MCU, 16-Bit

Includes a microcontroller unit for embedded control and processing tasks.

Utilized IC / Part: DRV2667

Uses advanced DRV2667 integrated circuit for optimized performance.

Supplied Contents: Board(s), Cable(s)

Comes with necessary components for immediate setup and connectivity.

Secondary Attributes: I2C Interface

Supports I2C communication interface for seamless integration with other devices.

Base Product Number: DRV2667

Based on DRV2667 core technology for reliable operation.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for use in various environments without concerns about moisture damage.

Technical Specifications

Additional Parts DRV2667EVM-CT attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-35763

Function:

Motor Controller/Driver, Haptic/Vibration

Type:

Power Management

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s), Cable(s)

Secondary Attributes:

I2C Interface

Utilized IC / Part:

DRV2667

Package:

Box

Embedded:

Yes, MCU, 16-Bit

Standard Package:

1

Base Product Number:

DRV2667

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DRV2667EVM-CT Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8537.10.9170

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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