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DP83816-MAAP

Texas Instruments

DP83816-MAAP by Texas Instruments

DP83816-MAAP by Texas Instruments is an Ethernet interface board with DP83816 IC. It comes in a box package and includes evaluation boards for development kits. The moisture sensitivity level is 1, making it suitable for various applications requiring high-speed Ethernet connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,283 parts In-Stock

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4,283

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Digiode

USA . 608 parts In-Stock

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608

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Distributors (Availability)

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Native Components

USA . 529 parts In-Stock

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$0.114

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-

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$0.109

529

$0.114

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$0.109

Northwest PG Solutions

USA . 1,774 parts In-Stock

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$0.125

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$0.110

1,774

$0.125

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$0.110

Ampacity Inc.

Singapore . 328 parts In-Stock

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$3.100

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328

$3.100

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Semicontronic

India . 1,360 parts In-Stock

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$5.100

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$4.972

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$4.947

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1,360

$5.100

$4.972

$4.947

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AZTECH Wire

Italy . 317 parts In-Stock

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$18.099

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317

$18.099

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One Stop Electronics

USA . 646 parts In-Stock

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$51.100

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646

$51.100

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Corphita

USA . 2,438 parts In-Stock

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DigiPath Technology Company

USA . 1,835 parts In-Stock

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ChromeModa Solutions

Germany . 1,469 parts In-Stock

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1,469

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Corohmni

South Africa . 342 parts In-Stock

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342

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Parana Technologies

USA . 279 parts In-Stock

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$0.871

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279

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$0.871

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IDEA Electronic Components Group

UK . 26 parts In-Stock

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26

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock the power of high-quality Ethernet interface with the DP83816-MAAP by Texas Instruments. Known for their exceptional manufacturing standards, Texas Instruments delivers top-notch products for various applications. The DP83816-MAAP is a game-changer in the development boards, kits, and programmers category, offering unparalleled value and benefits to customers. Whether you're looking for evaluation boards or demonstration kits, this interface board is the perfect solution for all your Ethernet needs. Elevate your projects with the DP83816-MAAP and experience seamless connectivity like never before.

Feature Benefit Bullets

Other Names: DP83816MAAP

This specific product has a unique identifier which makes it easy to search for and purchase.

Category: Development Boards, Kits, Programmers; Evaluation Boards; Evaluation and Demonstration Boards and Kits

This product falls under different categories, making it versatile for various uses in development and evaluation.

Package: Box

The product comes in a secure packaging box which ensures safe transportation and storage.

Type: Interface

Being an interface component, this product facilitates communication between different devices or systems.

Function: Ethernet

Designed for Ethernet functionality, this product can be used for networking tasks and data transmission.

Utilized IC / Part: DP83816

The product uses DP83816 IC or part which is known for its high performance and reliability in Ethernet applications.

Supplied Contents: Board(s)

The product includes necessary board(s) for immediate use or testing, offering convenience to the user.

Base Product Number: DP83816

This product's base number provides a reference point for compatibility and additional information about the product.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With a moisture sensitivity level of 1 (unlimited), this product is resistant to humidity and suitable for various environmental conditions.

Technical Specifications

Additional Parts DP83816-MAAP attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DP83816MAAP

Function:

Ethernet

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

DP83816

Package:

Box

Standard Package:

1

Base Product Number:

DP83816

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DP83816-MAAP Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991B1

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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