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DP8238J

Texas Instruments

DP8238J by Texas Instruments

DP8238J by Texas Instruments is a System Interface Logic IC with 28 terminals, operating at 4.75-5.25V. It features CMOS technology, supports 8080A bus compatibility, and generates control signals. Ideal for applications requiring a commercial temperature grade and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,879 parts In-Stock

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Digiode

USA . 1,580 parts In-Stock

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1,580

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Anansix

USA . 916 parts In-Stock

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916

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Mentor Electronics Marketing, LLC

USA . 7 parts In-Stock

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Pegasus Components GmbH

Germany . 2 parts In-Stock

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AZTECH Wire

Italy . 280 parts In-Stock

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$7.653

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280

$7.653

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One Stop Electronics

USA . 645 parts In-Stock

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$9.000

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645

$9.000

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Corohmni

South Africa . 1,918 parts In-Stock

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$57.099

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$57.099

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Parana Technologies

USA . 299 parts In-Stock

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$70.719

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$70.719

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DigiPath Technology Company

USA . 2,151 parts In-Stock

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$77.871

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$71.641

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$77.871

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ChromeModa Solutions

Germany . 6,564 parts In-Stock

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$79.460

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$65.157

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$79.460

$65.157

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IDEA Electronic Components Group

UK . 447 parts In-Stock

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$79.460

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$75.487

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$71.514

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447

$79.460

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$71.514

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Corphita

USA . 4,505 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,306 parts In-Stock

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Northwest PG Solutions

USA . 2,332 parts In-Stock

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$4.018

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Native Components

USA . 14 parts In-Stock

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$3.977

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$3.977

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Overview

Unlock the potential of your electronic systems with the DP8238J by Texas Instruments. Crafted with precision and expertise, this System Interface Logic IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this versatile component provides seamless integration and enhanced performance. Experience the value and benefits of cutting-edge technology with the DP8238J, where innovation meets excellence. Elevate your projects with confidence and efficiency, powered by Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for a wide range of applications and compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this product into existing systems and circuit designs.

No. of Terminals: 28

With a high number of terminals, this product offers versatility for connecting to other components and peripherals.

Minimum Operating Temperature: 0 °C

The wide temperature range allows for reliable operation in different environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

System Interface Logic ICs DP8238J attributes and parameters. Explore more System Interface Logic ICs devices from Texas Instruments

Specs

Bus Compatibility:

8080A

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.175 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

DP8238J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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