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DLP7000UVFLP

Texas Instruments

DLP7000UVFLP by Texas Instruments

DLP7000UVFLP by Texas Instruments is a rectangular consumer IC with 203 terminals. It operates b/w 20-30°C, with supply voltage ranging from 3-3.6V. This metal-sealed co-fired ceramic package is ideal for applications requiring precise optical control in compact devices.

Median Price

$4,812.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 102 parts In-Stock

1+ parts

$4,365.760

100+ parts

-

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102

$4,365.760

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Chip1Stop

Japan . 79 parts In-Stock

1+ parts

$5,260.000

100+ parts

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79

$5,260.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.407

100+ parts

-

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500

$3.407

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Digiode

USA . 1,468 parts In-Stock

1+ parts

$4,147.472

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1,468

$4,147.472

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Vyrian

USA . 7,843 parts In-Stock

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7,843

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 263 parts In-Stock

1+ parts

$1.256

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263

$1.256

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Parana Technologies

USA . 51 parts In-Stock

1+ parts

$1.257

100+ parts

-

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$2.026

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51

$1.257

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$2.026

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Northwest PG Solutions

USA . 805 parts In-Stock

1+ parts

$1.382

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805

$1.382

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DigiPath Technology Company

USA . 1,726 parts In-Stock

1+ parts

$1.384

100+ parts

$1.273

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-

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1,726

$1.384

$1.273

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ChromeModa Solutions

Germany . 1,759 parts In-Stock

1+ parts

$1.412

100+ parts

$1.158

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-

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1,759

$1.412

$1.158

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IDEA Electronic Components Group

UK . 141 parts In-Stock

1+ parts

$1.412

100+ parts

-

1k+ parts

$1.271

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141

$1.412

-

$1.271

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Microchip USA

USA . 862 parts In-Stock

1+ parts

$2.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

862

$2.000

$1.000

$1.000

$1.000

AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$18.730

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329

$18.730

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Corphita

USA . 4,989 parts In-Stock

1+ parts

$3,929.184

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4,989

$3,929.184

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Overview

Unleash the power of cutting-edge technology with the DLP7000UVFLP from Texas Instruments. Known for their commitment to quality and innovation, Texas Instruments has created a product that exceeds expectations in the realm of consumer ICs. This versatile device is perfect for a wide range of applications, offering unmatched performance and reliability. Experience the value and benefits of this exceptional product, designed to provide you with a seamless and efficient solution for all your electronic needs. Elevate your projects to new heights with the DLP7000UVFLP - the ultimate choice for those who demand excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and reliability, making this product suitable for long-term use.

Surface Mount: YES

The surface mount capability makes it easier to integrate this product onto circuit boards, saving space and simplifying the overall design.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, this product is designed for various consumer electronics applications, ensuring compatibility and performance for everyday use.

Maximum Operating Temperature: 30 °C

With a maximum operating temperature of 30°C, this product can withstand high temperature environments without compromising its functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers superior conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Width: 31.75 mm

The compact width of 31.75 mm allows for easy integration into various electronic devices, making it a versatile choice for different applications.

Technical Specifications

Other Function Consumer ICs DLP7000UVFLP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-B203

JESD-609 Code:

e4

Length:

40.64 mm

No. of Functions:

1

No. of Terminals:

203

Maximum Operating Temperature:

30 Cel

Minimum Operating Temperature:

20 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

6.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

BOTTOM

Width:

31.75 mm

Trade Compliance

DLP7000UVFLP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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