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DLP301SFQS

Texas Instruments

DLP301SFQS by Texas Instruments

DLP301SFQS by Texas Instruments is a ceramic, metal-sealed co-fired IC with 99 terminals. It operates b/w 0-40°C and features nickel gold terminal finish. This consumer circuit IC is surface mountable and suitable for various electronic applications.

Median Price

$86.720

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 545 parts In-Stock

1+ parts

$66.500

100+ parts

$64.500

1k+ parts

$50.000

10k+ parts

-

545

$66.500

$64.500

$50.000

-

Mouser Electronics

USA . 109 parts In-Stock

1+ parts

$106.940

100+ parts

$85.040

1k+ parts

-

10k+ parts

-

109

$106.940

$85.040

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,621 parts In-Stock

1+ parts

$63.175

100+ parts

-

1k+ parts

-

10k+ parts

-

3,621

$63.175

-

-

-

Vyrian

USA . 3,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,922

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 966 parts In-Stock

1+ parts

$14.600

100+ parts

-

1k+ parts

-

10k+ parts

-

966

$14.600

-

-

-

Ampacity Inc.

Singapore . 462 parts In-Stock

1+ parts

$56.520

100+ parts

-

1k+ parts

-

10k+ parts

-

462

$56.520

-

-

-

Semicontronic

India . 280 parts In-Stock

1+ parts

$56.520

100+ parts

$55.107

1k+ parts

$54.824

10k+ parts

-

280

$56.520

$55.107

$54.824

-

Corphita

USA . 4,485 parts In-Stock

1+ parts

$59.850

100+ parts

-

1k+ parts

-

10k+ parts

-

4,485

$59.850

-

-

-

Corohmni

South Africa . 422 parts In-Stock

1+ parts

$66.500

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$66.500

-

-

-

Native Components

USA . 761 parts In-Stock

1+ parts

$490.525

100+ parts

$480.715

1k+ parts

$475.809

10k+ parts

$470.904

761

$490.525

$480.715

$475.809

$470.904

Northwest PG Solutions

USA . 2,344 parts In-Stock

1+ parts

$539.578

100+ parts

-

1k+ parts

-

10k+ parts

-

2,344

$539.578

-

-

-

Overview

Discover the cutting-edge DLP301SFQS by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. With a ceramic, metal-sealed package and surface mount capability, this IC is ideal for a wide range of applications. Experience the value and benefits of Texas Instruments' superior manufacturing standards, ensuring top-notch quality and durability. Upgrade your projects with the DLP301SFQS and unlock endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and protection for the integrated circuit, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and facilitates easy installation.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics applications, ensuring reliability and performance in everyday use.

No. of Terminals: 99

The high number of terminals allows for versatile connectivity and functionality in complex circuits.

Maximum Operating Temperature: 40 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: NICKEL GOLD

Nickel gold finish provides excellent conductivity and corrosion resistance, enhancing the overall lifespan of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enhances heat dissipation for improved performance.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with RoHS regulations, making it a sustainable choice.

Technical Specifications

Other Function Consumer ICs DLP301SFQS attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N99

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

99

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

DLP301SFQS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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