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DIR9001IPWRQ1G4

Texas Instruments

DIR9001IPWRQ1G4 by Texas Instruments

The Texas Instruments DIR9001IPWRQ1G4 is a consumer IC with 28 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage range of 2.7V to 3.6V and a max current of 12.4mA, suitable for industrial applications requiring precise signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,230 parts In-Stock

1+ parts

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7,230

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Digiode

USA . 2,172 parts In-Stock

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2,172

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 330 parts In-Stock

1+ parts

$2.652

100+ parts

$246.297

1k+ parts

$2.387

10k+ parts

-

330

$2.652

$246.297

$2.387

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DigiPath Technology Company

USA . 552 parts In-Stock

1+ parts

$2.920

100+ parts

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552

$2.920

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ChromeModa Solutions

Germany . 1,772 parts In-Stock

1+ parts

$2.980

100+ parts

$2.444

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1,772

$2.980

$2.444

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IDEA Electronic Components Group

UK . 1,210 parts In-Stock

1+ parts

$2.980

100+ parts

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1k+ parts

$2.682

10k+ parts

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1,210

$2.980

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$2.682

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AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$6.027

100+ parts

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735

$6.027

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One Stop Electronics

USA . 1,471 parts In-Stock

1+ parts

$10.800

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1,471

$10.800

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Ampacity Inc.

Singapore . 160 parts In-Stock

1+ parts

$12.800

100+ parts

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160

$12.800

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Corphita

USA . 4,943 parts In-Stock

1+ parts

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4,943

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Experience superior quality and reliability with the DIR9001IPWRQ1G4 by Texas Instruments. This consumer circuit IC is designed to meet the highest industry standards, making it ideal for a wide range of applications. From automotive to industrial use, this IC offers exceptional performance and durability. Trust in Texas Instruments' reputation for excellence and innovation, and unlock the full potential of your projects with the DIR9001IPWRQ1G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This makes the product lightweight and durable, ideal for consumer electronics.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Screening Level: AEC-Q100

Ensures high quality and reliability for automotive applications.

Package Shape: RECTANGULAR

Provides a standard form factor for easy integration into existing designs.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring optimal performance.

Power Supplies (V): 3.3

Compatible with common power sources, making it versatile for various applications.

No. of Terminals: 28

Offers ample connection options for interfacing with other components.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without impacting performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Allows for flexibility in circuit board layout and connection options.

Maximum Seated Height: 1.2 mm

Low profile design for slim devices or tight spaces.

Width: 4.4 mm

Compact form factor for space-efficient designs.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate with minimal power input, improving energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperatures during manufacturing processes.

Length: 9.7 mm

Standard length for easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperatures.

Terminal Form: GULL WING

Secure and stable terminal design for reliable connections.

Maximum Supply Current: 12.4 mA

Low power consumption for energy-efficient operation.

Terminal Pitch: 0.65 mm

Fine pitch spacing for compact designs and increased density.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture, ensuring reliability in humid conditions.

Maximum Supply Voltage (Vsup): 3.6 V

Compatible with higher voltage sources for flexibility in power requirements.

Technical Specifications

Other Function Consumer ICs DIR9001IPWRQ1G4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

12.4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

DIR9001IPWRQ1G4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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