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DEM-OPA-SOT-1A

Texas Instruments

DEM-OPA-SOT-1A by Texas Instruments

Limited Part Number Data;

Median Price

$5.970

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 103 parts In-Stock

1+ parts

$5.000

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103

$5.000

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Newark

USA . 51 parts In-Stock

1+ parts

$5.630

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51

$5.630

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Arrow

USA . 4 parts In-Stock

1+ parts

$5.941

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4

$5.941

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DigiKey

USA . 47 parts In-Stock

1+ parts

$6.000

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47

$6.000

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RS (Exports)

UK . 13 parts In-Stock

1+ parts

$8.651

100+ parts

$8.296

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13

$8.651

$8.296

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Element14

Singapore . 51 parts In-Stock

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$9.000

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51

$9.000

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Distributors (In-Stock)

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Digiode

USA . 2,831 parts In-Stock

1+ parts

$4.750

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2,831

$4.750

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Vyrian

USA . 2,824 parts In-Stock

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$5.000

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2,824

$5.000

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Elcom Components

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 583 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

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10k+ parts

$0.128

583

$0.133

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-

$0.128

Northwest PG Solutions

USA . 1,454 parts In-Stock

1+ parts

$0.146

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-

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$0.129

1,454

$0.146

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$0.129

Corphita

USA . 1,518 parts In-Stock

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$4.500

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1,518

$4.500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

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1,462

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ChromeModa Solutions

Germany . 1,264 parts In-Stock

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1,264

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DigiPath Technology Company

USA . 100 parts In-Stock

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100

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Parana Technologies

USA . 10 parts In-Stock

1+ parts

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$1.067

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10

-

-

$1.067

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Perfect Parts

USA . 6 parts In-Stock

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6

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Technical Specifications

Additional Parts DEM-OPA-SOT-1A attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-296-20840
-DEM-OPA-SOT-1A-NDR
296-20840-NDR
DEMOPASOT1A
296-20840
-296-20840-ND

Channels per IC:

1 - Single

Category:

Development Boards, Kits, Programmers
Evaluation Boards Op Amp Evaluation Boards

Supplied Contents:

Board(s)

Output Type:

Single-Ended

Board Type:

Bare (Unpopulated)

Utilized IC / Part:

SOT-23-5, SOT-23-6 Package

Package:

Box

Amplifier Type:

General Purpose

Standard Package:

1

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DEM-OPA-SOT-1A Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8534.00.0095

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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