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DAPSIGCNDBRDUNPEVM

Texas Instruments

DAPSIGCNDBRDUNPEVM by Texas Instruments

DAPSIGCNDBRDUNPEVM by Texas Instruments is a dual-channel Op Amp Evaluation Board with 22V/µs slew rate and 40 mA output current. It operates on 2.5V to 5.5V supply voltage, ideal for evaluating OPA2350 IC performance in single-ended applications. This fully populated board is designed for development and evaluation of op amp circuits in various electronic systems.

Median Price

$39.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 6 parts In-Stock

1+ parts

$39.750

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$39.750

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Vyrian

USA . 6,589 parts In-Stock

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6,589

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Digiode

USA . 4,719 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Dan-Mar Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 688 parts In-Stock

1+ parts

$12.284

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688

$12.284

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One Stop Electronics

USA . 1,571 parts In-Stock

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$193.100

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DigiPath Technology Company

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,925 parts In-Stock

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$0.851

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1,925

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$0.851

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ChromeModa Solutions

Germany . 1,816 parts In-Stock

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1,816

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IDEA Electronic Components Group

UK . 1,743 parts In-Stock

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1,743

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Corphita

USA . 1,527 parts In-Stock

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1,527

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Northwest PG Solutions

USA . 1,401 parts In-Stock

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$3.974

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1,401

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$3.974

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Native Components

USA . 618 parts In-Stock

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$3.933

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618

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$3.933

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Upgrade your projects with the high-quality DAPSIGCNDBRDUNPEVM by Texas Instruments. This versatile development board is perfect for evaluating Op Amp circuits and testing dual-channel applications. With a sleek design and reliable performance, this board offers unmatched value and benefits to customers. Whether you're an electronics enthusiast or a seasoned engineer, the DAPSIGCNDBRDUNPEVM is sure to enhance your projects and take your designs to the next level.

Feature Benefit Bullets

Other Names

Multiple search options make it easy to find this product online.

Category

Versatile usage for development and evaluation purposes.

Package

Convenient bulk packaging for stocking multiple units.

Channels per IC

Dual channels provide flexibility for different applications.

Output Type

Compatible with single-ended output systems.

Slew Rate

Fast slew rate for responsive signal processing.

Current - Output / Channel

High current output capability for driving components.

Current - Supply (Main IC)

Low power consumption for energy efficiency.

Voltage - Supply, Single/Dual (±)

Wide voltage range for compatibility with various power sources.

Board Type

Ready-to-use board for quick setup and testing.

Supplied Contents

Includes necessary boards for immediate use.

Utilized IC / Part

Utilizes a high-quality operational amplifier for accurate performance.

Base Product Number

Part of a product line for easy identification and compatibility.

Moisture Sensitivity Level (MSL)

No restrictions on exposure to moisture, ensuring durability.

Technical Specifications

Additional Parts DAPSIGCNDBRDUNPEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-18419
-296-18419-ND
296-18419-NDR
-296-18419
-DAPSIGCNDBRDUNPEVM-NDR

Channels per IC:

2 - Dual

Category:

Development Boards, Kits, Programmers
Evaluation Boards Op Amp Evaluation Boards

Output Type:

Single-Ended

Slew Rate:

22V/µs

Current - Supply (Main IC):

5.2 mA

Standard Package:

1

Supplied Contents:

Board(s)

Board Type:

Fully Populated

Voltage - Supply, Single/Dual (±):

2.5V ~ 5.5V

Utilized IC / Part:

OPA2350

Package:

Bulk

Amplifier Type:

General Purpose

Current - Output / Channel:

40 mA

Base Product Number:

DAPSIGCN

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAPSIGCNDBRDUNPEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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