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DAC8832EVM

Texas Instruments

DAC8832EVM by Texas Instruments

DAC8832EVM by Texas Instruments is a 16-bit DAC Evaluation Board with SPI interface, 50MSPS sampling rate, and 1µs settling time. It is used for voltage DAC applications, offering high precision and fast performance for various development projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,559 parts In-Stock

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Digiode

USA . 226 parts In-Stock

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Native Components

USA . 565 parts In-Stock

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$6.142

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AZTECH Wire

Italy . 481 parts In-Stock

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$18.348

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One Stop Electronics

USA . 787 parts In-Stock

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$75.100

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Ampacity Inc.

Singapore . 191 parts In-Stock

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$79.100

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Component Stockers USA

USA . 332 parts In-Stock

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$99.990

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Semicontronic

India . 353 parts In-Stock

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$171.100

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$166.822

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$165.967

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353

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$165.967

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ChromeModa Solutions

Germany . 5,135 parts In-Stock

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Corphita

USA . 2,579 parts In-Stock

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DigiPath Technology Company

USA . 1,844 parts In-Stock

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IDEA Electronic Components Group

UK . 1,263 parts In-Stock

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Parana Technologies

USA . 859 parts In-Stock

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$0.932

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Corohmni

South Africa . 409 parts In-Stock

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Northwest PG Solutions

USA . 288 parts In-Stock

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$6.020

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Overview

Experience the power of precision with the Texas Instruments DAC8832EVM evaluation board. Manufactured by industry leader Texas Instruments, this high-quality board showcases the exceptional performance of digital-to-analog converters (DACs). Ideal for a wide range of applications, this board offers customers unparalleled value and benefits in terms of accuracy, speed, and reliability. Unlock new possibilities and enhance your projects with the DAC8832EVM.

Feature Benefit Bullets

Number of Bits: 16

This high resolution allows for precise conversion of digital signals to analog voltages, resulting in accurate output.

Sampling Rate (Per Second): 50M

The fast sampling rate ensures real-time performance and high speed signal processing, making it suitable for applications requiring quick response times.

Data Interface: SPI

The SPI interface is widely used in communication between microcontrollers and peripheral devices, offering a simple and efficient way to control the DAC.

Settling Time: 1 µs

The fast settling time ensures that the output voltage stabilizes quickly after a change in input, allowing for fast and accurate voltage adjustments.

DAC Type: Voltage

Voltage output DACs are commonly used for applications where precise voltage levels are required, making this product suitable for voltage-controlled systems.

Technical Specifications

Additional Parts DAC8832EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DAC8832EVM-ND
296-30889

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

SPI

Settling Time:

1 µs

Standard Package:

1

DAC Type:

Voltage

Number of DAC's:

1

Supplied Contents:

Board(s)

Number of Bits:

16

Utilized IC / Part:

DAC8832

Package:

Box

Sampling Rate (Per Second):

50M

Base Product Number:

DAC8832

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC8832EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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