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DAC8555EVM

Texas Instruments

DAC8555EVM by Texas Instruments

DAC8555EVM by Texas Instruments is a 4-channel, 16-bit DAC Evaluation Board with a sampling rate of 1MSPS. It features a serial data interface and settling time of 8µs. Ideal for applications requiring precise voltage output control, the board includes DAC8555 IC and is suitable for development projects in need of high-speed analog-to-digital conversion capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,613 parts In-Stock

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Digiode

USA . 2,579 parts In-Stock

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Native Components

USA . 662 parts In-Stock

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$5.766

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662

$5.766

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One Stop Electronics

USA . 213 parts In-Stock

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$10.100

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AZTECH Wire

Italy . 426 parts In-Stock

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$10.515

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Semicontronic

India . 540 parts In-Stock

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$18.100

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$17.648

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$17.557

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540

$18.100

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$17.557

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Ampacity Inc.

Singapore . 138 parts In-Stock

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$171.100

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$171.100

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ChromeModa Solutions

Germany . 6,669 parts In-Stock

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DigiPath Technology Company

USA . 2,321 parts In-Stock

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Corphita

USA . 2,033 parts In-Stock

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Northwest PG Solutions

USA . 1,842 parts In-Stock

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

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Parana Technologies

USA . 1,105 parts In-Stock

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Corohmni

South Africa . 243 parts In-Stock

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Overview

Experience the power of precision with the DAC8555EVM by Texas Instruments. Crafted with excellence, this evaluation board is designed to elevate your projects to new heights, offering unparalleled performance and reliability. Whether you're a seasoned professional or a budding enthusiast, this versatile tool is perfect for a wide range of applications in the field of digital to analog converters. Trust in Texas Instruments' legacy of innovation and quality, and unlock the full potential of your designs with the DAC8555EVM.

Feature Benefit Bullets

Number of DAC's: 4

Having 4 DACs allows for more flexibility and control over multiple output signals, making this board suitable for applications that require precision control over multiple channels.

Number of Bits: 16

With 16 bits of resolution, this board can provide high accuracy and precision in converting digital signals to analog voltages, making it suitable for applications that require fine control.

Sampling Rate (Per Second): 1M

With a high sampling rate of 1M per second, this board can accurately capture and convert fast-changing digital signals into analog voltages, making it ideal for real-time control applications.

Data Interface: Serial

The serial data interface simplifies the connection of this board to a microcontroller or computer, allowing for easy integration into existing systems.

Settling Time: 8 µs

The fast settling time of 8 µs ensures that the output voltage stabilizes quickly after a change in the input signal, making this board suitable for applications that require rapid response and accuracy.

DAC Type: Voltage

Being a voltage DAC allows for precise control and generation of analog voltage signals, making this board suitable for applications such as motor control, audio processing, and instrumentation.

Technical Specifications

Additional Parts DAC8555EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-52346
DAC8555EVM-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

Serial

Settling Time:

8 µs

Standard Package:

1

DAC Type:

Voltage

Number of DAC's:

4

Supplied Contents:

Board(s)

Number of Bits:

16

Utilized IC / Part:

DAC8555

Package:

Box

Sampling Rate (Per Second):

1M

Base Product Number:

DAC8555

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC8555EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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