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DAC8234EVM

Texas Instruments

DAC8234EVM by Texas Instruments

DAC8234EVM by Texas Instruments is a Development Board with 4x14-bit DACs using SPI interface. It offers 8 µs settling time for voltage output applications. Ideal for evaluating DAC8234 IC performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,133 parts In-Stock

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Digiode

USA . 3,328 parts In-Stock

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Semtec, LLC

USA . 1 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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AZTECH Wire

Italy . 190 parts In-Stock

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$9.975

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Ampacity Inc.

Singapore . 1,517 parts In-Stock

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$27.100

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Native Components

USA . 91 parts In-Stock

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$52.470

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$50.371

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Northwest PG Solutions

USA . 95 parts In-Stock

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$57.717

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One Stop Electronics

USA . 624 parts In-Stock

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$209.100

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ChromeModa Solutions

Germany . 5,185 parts In-Stock

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Corphita

USA . 3,578 parts In-Stock

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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Parana Technologies

USA . 854 parts In-Stock

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IDEA Electronic Components Group

UK . 314 parts In-Stock

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Overview

Experience unparalleled precision and performance with the DAC8234EVM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This evaluation board is perfect for those looking to explore the endless possibilities of digital to analog converters (DACs) in various applications. With its user-friendly interface and fast settling time, this product offers exceptional value and benefits to customers seeking high-quality solutions for their projects. Unlock the full potential of your designs with the DAC8234EVM today.

Feature Benefit Bullets

Number of DAC's: 4

Having 4 DAC's allows for multiple independent voltage output signals, increasing flexibility in circuit design and applications.

Number of Bits: 14

With 14 bits resolution, this DAC provides high precision output signals, ensuring accuracy in voltage levels.

Data Interface: SPI

Using SPI interface allows for easy integration with microcontrollers and communication with other digital devices, simplifying the development process.

Settling Time: 8 µs

The fast settling time of 8 µs ensures quick response and stability in voltage output changes, ideal for dynamic applications that require rapid adjustments.

DAC Type: Voltage

Being a voltage DAC, it provides precise control over voltage output levels, making it suitable for analog signal generation and control applications.

Supplied Contents: Board(s)

The inclusion of necessary boards simplifies setup and evaluation process, making it convenient for users to start using the DAC immediately.

Utilized IC / Part: DAC8234

The use of DAC8234 ensures compatibility and optimized performance with the specific DAC chip, guaranteeing reliable operation.

Technical Specifications

Additional Parts DAC8234EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DAC8234EVM-ND
296-30872

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

SPI

Settling Time:

8 µs

Standard Package:

1

DAC Type:

Voltage

Number of DAC's:

4

Supplied Contents:

Board(s)

Number of Bits:

14

Utilized IC / Part:

DAC8234

Package:

Box

Base Product Number:

DAC8234

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC8234EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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