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DAC7742YB/2KG4

Texas Instruments

DAC7742YB/2KG4 by Texas Instruments

DAC7742YB/2KG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of ±10 V. It has a settling time of 5 us and linearity error of 0.0061%. Ideal for industrial applications requiring precise voltage outputs in the -40 to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,661 parts In-Stock

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Digiode

USA . 1,400 parts In-Stock

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AZTECH Wire

Italy . 875 parts In-Stock

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$15.348

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$15.348

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Native Components

USA . 970 parts In-Stock

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$16.819

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$16.819

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Northwest PG Solutions

USA . 678 parts In-Stock

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$18.501

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$16.651

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Parana Technologies

USA . 1,883 parts In-Stock

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$21.979

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$2,041.042

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$19.781

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1,883

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DigiPath Technology Company

USA . 2,105 parts In-Stock

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$24.201

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$22.265

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$24.201

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ChromeModa Solutions

Germany . 1,384 parts In-Stock

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$24.695

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$20.250

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$24.695

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IDEA Electronic Components Group

UK . 35 parts In-Stock

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$24.695

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$23.460

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$22.226

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One Stop Electronics

USA . 263 parts In-Stock

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$30.000

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Corphita

USA . 534 parts In-Stock

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Microchip USA

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Overview

Unlock the power of precision and reliability with the Texas Instruments DAC7742YB/2KG4 Digital-to-Analog Converter. Crafted by a trusted industry leader, this cutting-edge device offers unparalleled performance for a wide range of applications. Experience seamless integration, enhanced efficiency, and superior output quality with this advanced technology. Elevate your projects to new heights with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

High maximum analog output voltage allows for a wide range of signal strength, making this product suitable for various applications requiring different output levels.

No. of Bits: 16

With 16 bits, this product offers high resolution and accuracy in converting digital signals to analog, ensuring precise output signal representation.

Maximum Settling Time: 5 us

Fast settling time of 5 microseconds ensures quick response and stability in the analog output signal, making it suitable for real-time applications.

Power Supplies (V): 5,+-15

Wide range of power supply voltages (5V, ±15V) enable flexibility in powering the converter, allowing for compatibility with various systems and environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability and performance in harsh industrial environments, making it suitable for industrial applications.

Technical Specifications

Digital-to-Analog Converters DAC7742YB/2KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Complementary Binary, Complementary Offset Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

3 µs

Maximum Settling Time:

5 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

Trade Compliance

DAC7742YB/2KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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