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DAC7664YCTG4

Texas Instruments

DAC7664YCTG4 by Texas Instruments

DAC7664YCTG4 by Texas Instruments is a 16-bit D/A converter with max output voltage of ±2.5V, settling time of 15us, and linearity error of 0.0046%. Ideal for industrial applications requiring precise analog signal generation in temperature range -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,080 parts In-Stock

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Digiode

USA . 3,549 parts In-Stock

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3,549

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Distributors (Availability)

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AZTECH Wire

Italy . 262 parts In-Stock

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$8.438

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Parana Technologies

USA . 1,746 parts In-Stock

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$8.869

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$9.552

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$8.869

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ChromeModa Solutions

Germany . 6,282 parts In-Stock

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$9.965

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$8.171

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$9.965

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IDEA Electronic Components Group

UK . 840 parts In-Stock

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$9.965

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$9.467

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$8.968

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840

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$8.968

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One Stop Electronics

USA . 430 parts In-Stock

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$30.000

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Corphita

USA . 4,008 parts In-Stock

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Northwest PG Solutions

USA . 2,005 parts In-Stock

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Microchip USA

USA . 981 parts In-Stock

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Native Components

USA . 318 parts In-Stock

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$3.654

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DigiPath Technology Company

USA . 66 parts In-Stock

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$8.984

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Overview

Unleash the power of precision with the Texas Instruments DAC7664YCTG4 digital-to-analog converter. Crafted by the industry leader, this cutting-edge device offers unparalleled accuracy and efficiency in a wide range of applications. Elevate your projects with a maximum analog output voltage of 2.5V and a lightning-fast settling time of just 15us. Experience the quality and reliability that Texas Instruments is renowned for, while enjoying the seamless performance and value that the DAC7664YCTG4 brings to the table. Whether you're in industrial automation, telecommunications, or automotive electronics, this versatile converter is your ticket to superior results.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5 V

The high maximum analog output voltage of 2.5 V allows for a wide range of output signals, making this product versatile for various applications.

No. of Bits: 16

With 16 bits, this digital-to-analog converter offers high resolution and accuracy in converting digital signals to analog, providing precise output control.

Maximum Settling Time: 15 us

The fast settling time of 15 microseconds ensures quick and accurate conversion, making it suitable for applications that require rapid response times.

Power Supplies (V): 5

With a nominal supply voltage of 5V, this product is compatible with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of -40 to 85°C makes this converter suitable for use in industrial environments with varying temperature conditions.

Technical Specifications

Digital-to-Analog Converters DAC7664YCTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0046 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

5 mA

Maximum Settling Time:

15 µs

Sample Rate:

100 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-2.5 V

Maximum Analog Output Voltage:

2.5 V

Power Supplies:

5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Trade Compliance

DAC7664YCTG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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