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DAC7625U/1KG4

Texas Instruments

DAC7625U/1KG4 by Texas Instruments

DAC7625U/1KG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 2.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 85 °C, has a sample rate of 0.1 MHz, and uses CMOS technology for parallel word input format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,183 parts In-Stock

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Vyrian

USA . 2,224 parts In-Stock

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AZTECH Wire

Italy . 498 parts In-Stock

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$5.830

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498

$5.830

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$8.684

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$7.902

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$7.121

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$8.684

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Parana Technologies

USA . 1,242 parts In-Stock

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$12.210

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$12.629

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$12.629

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ChromeModa Solutions

Germany . 2,964 parts In-Stock

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$13.719

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$11.250

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$13.719

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IDEA Electronic Components Group

UK . 1,291 parts In-Stock

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$13.719

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$13.033

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$12.347

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Corohmni

South Africa . 416 parts In-Stock

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$14.175

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One Stop Electronics

USA . 1,214 parts In-Stock

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$31.000

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Corphita

USA . 4,137 parts In-Stock

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Microchip USA

USA . 2,417 parts In-Stock

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Northwest PG Solutions

USA . 2,211 parts In-Stock

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DigiPath Technology Company

USA . 2,159 parts In-Stock

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$12.369

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Native Components

USA . 404 parts In-Stock

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Overview

Unlock the power of precision and reliability with the Texas Instruments DAC7625U/1KG4 Digital-to-Analog Converter. Crafted by a renowned manufacturer, this cutting-edge device offers unparalleled performance in a wide range of applications. Whether you're in need of high-quality audio reproduction or precise voltage control, this converter delivers exceptional value, benefits, and advantages to meet your needs. Trust in Texas Instruments to provide top-notch quality and innovation for all your digital-to-analog conversion requirements.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals.

No. of Bits: 12

High resolution with 12 bits provides accurate conversion of digital signals to analog.

Maximum Settling Time: 10 us

Fast settling time ensures minimal delay in converting digital signals to analog output.

Technology: CMOS

Utilizes CMOS technology for efficient and low-power operation.

Sample Rate: 0.1 MHz

Supports a high sample rate of 0.1 MHz for accurate and real-time analog signal generation.

Technical Specifications

Digital-to-Analog Converters DAC7625U/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0488 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

1.9 mA

Maximum Settling Time:

10 µs

Sample Rate:

100 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-2.5 V

Maximum Analog Output Voltage:

2.5 V

Power Supplies:

5/±5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC7625U/1KG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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