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DAC7617UB/1KG4

Texas Instruments

DAC7617UB/1KG4 by Texas Instruments

DAC7617UB/1KG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 1.25V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 85°C, consumes 1mA supply current at 3.3V, and features serial input format for precise conversions in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,392 parts In-Stock

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Digiode

USA . 3,247 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 575 parts In-Stock

1+ parts

$6.000

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575

$6.000

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AZTECH Wire

Italy . 726 parts In-Stock

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$8.940

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726

$8.940

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Ampacity Inc.

Singapore . 679 parts In-Stock

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$9.000

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$9.000

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Native Components

USA . 592 parts In-Stock

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$11.413

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592

$11.413

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Northwest PG Solutions

USA . 314 parts In-Stock

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$12.555

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$11.299

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314

$12.555

$11.299

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Parana Technologies

USA . 2,336 parts In-Stock

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$21.913

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$22.410

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2,336

$21.913

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$22.410

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DigiPath Technology Company

USA . 1,003 parts In-Stock

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$24.129

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$22.198

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$24.129

$22.198

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ChromeModa Solutions

Germany . 4,844 parts In-Stock

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$24.621

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$20.189

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$24.621

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IDEA Electronic Components Group

UK . 1,249 parts In-Stock

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$24.621

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$23.390

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$22.159

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1,249

$24.621

$23.390

$22.159

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QUARKTWIN TECHNOLOGY LTD

USA . 26,418 parts In-Stock

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Microchip USA

USA . 5,391 parts In-Stock

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Corphita

USA . 4,973 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the DAC7617UB/1KG4 by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments delivers cutting-edge technology that meets the highest quality standards. Ideal for industrial applications, this product offers seamless integration, fast settling times, and exceptional linearity. Experience the value of superior performance and efficiency with the DAC7617UB/1KG4, setting new industry benchmarks in analog output voltage control. Elevate your projects to new heights with Texas Instruments at the forefront of innovation.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

Provides a high maximum analog output voltage, allowing for a wide range of output levels and versatility in applications.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection for the internal components of the digital-to-analog converter.

Surface Mount: YES

Being surface mountable makes installation and integration of this product easy and efficient.

No. of Bits: 12

With 12 bits, this digital-to-analog converter can provide a high resolution and accuracy in converting digital signals to analog output.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and accurate output results.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures accurate and precise conversion of digital signals to analog output.

Power Supplies (V): 3

Operates efficiently with a standard power supply voltage of 3V.

No. of Terminals: 16

Provides multiple terminals for easy connectivity and integration into different systems.

Nominal Settling Time (tstl): 5 us

Efficient settling time ensures fast response and reliable output performance.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature environments, ensuring reliability in various conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and connectivity options.

Maximum Seated Height: 2.65 mm

Low seated height allows for space-saving and compact design considerations.

Width: 7.5 mm

Narrow width makes it suitable for applications where space is limited.

Minimum Analog Output Voltage: 0 V

Provides flexibility in output voltage range, allowing for different signal levels as needed.

Length: 10.3 mm

Compact length makes it suitable for integration into small electronic devices or systems.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connection in surface mount applications.

Maximum Supply Current: 1 mA

Low supply current requirement reduces power consumption and ensures efficiency in operation.

Input Format: SERIAL

Serial input format allows for easy interfacing with digital systems and devices.

Converter Type: D/A CONVERTER

Specifically designed for digital-to-analog conversion applications, ensuring optimal performance in this function.

Nominal Supply Voltage: 3.3 V

Operates efficiently with a nominal supply voltage of 3.3V, ensuring compatibility with common power sources.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for compact design and easy integration into electronic systems.

Input Bit Code: BINARY

Uses binary input bit code for digital signals, ensuring compatibility with a wide range of digital systems and devices.

Technical Specifications

Digital-to-Analog Converters DAC7617UB/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

1 mA

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.406 in (10.3 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

Trade Compliance

DAC7617UB/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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