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DAC7617E/1KG4

Texas Instruments

DAC7617E/1KG4 by Texas Instruments

DAC7617E/1KG4 by Texas Instruments is a 12-bit D/A converter with 1.25V max analog output voltage and 10us settling time. Ideal for industrial applications, it operates b/w -40 to 85°C, features a small outline package, and consumes only 1mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,694 parts In-Stock

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Digiode

USA . 3,522 parts In-Stock

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Native Components

USA . 443 parts In-Stock

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$6.343

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One Stop Electronics

USA . 1,152 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 282 parts In-Stock

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$19.485

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Parana Technologies

USA . 1,569 parts In-Stock

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$23.731

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$24.362

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DigiPath Technology Company

USA . 734 parts In-Stock

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$26.131

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$24.040

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734

$26.131

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ChromeModa Solutions

Germany . 4,579 parts In-Stock

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$26.664

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$21.864

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IDEA Electronic Components Group

UK . 1,886 parts In-Stock

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$26.664

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$25.331

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$23.998

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QUARKTWIN TECHNOLOGY LTD

USA . 5,745 parts In-Stock

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Corphita

USA . 3,254 parts In-Stock

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Northwest PG Solutions

USA . 935 parts In-Stock

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Microchip USA

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Overview

Unlock the power of precision with the Texas Instruments DAC7617E/1KG4 Digital-to-Analog Converter. Crafted by a trusted industry leader, this innovative device delivers unparalleled performance and reliability for a wide range of applications. Whether you're designing industrial automation systems or creating cutting-edge audio equipment, this compact and efficient converter offers exceptional value, accuracy, and speed. Experience the difference with Texas Instruments and take your projects to the next level with the DAC7617E/1KG4.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

Allows for a wide range of analog output values, providing flexibility in output signal levels.

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging the converter, ensuring longevity and reliability.

Surface Mount: YES

Ease of installation and space-saving design, suitable for compact electronic devices.

No. of Bits: 12

Higher resolution and accuracy in converting digital signals to analog, providing precise output.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and accuracy in generating analog signals.

Power Supplies (V): 3

Operates efficiently at a standard voltage, making it compatible with various systems.

Nominal Settling Time (tstl): 5 us

Further enhances the speed and accuracy of signal conversion, ideal for real-time applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact and space-efficient packaging, suitable for devices with limited space.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environments and conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter efficient and reliable.

Technical Specifications

Digital-to-Analog Converters DAC7617E/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0488 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

1 mA

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP20,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Trade Compliance

DAC7617E/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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