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DAC7553IRGTTG4

Texas Instruments

DAC7553IRGTTG4 by Texas Instruments

DAC7553IRGTTG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.5V and settling time of 5us. Ideal for industrial applications, it operates b/w -40 to 105 °C, has a sample rate of 1MHz, and consumes only 0.44mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,234 parts In-Stock

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Digiode

USA . 1,212 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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AZTECH Wire

Italy . 669 parts In-Stock

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$15.781

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669

$15.781

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One Stop Electronics

USA . 578 parts In-Stock

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$16.000

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578

$16.000

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Parana Technologies

USA . 1,071 parts In-Stock

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$23.141

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$23.778

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$23.141

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Semicontronic

India . 1,147 parts In-Stock

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$26.000

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$25.350

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$25.220

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$26.000

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$25.220

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ChromeModa Solutions

Germany . 4,289 parts In-Stock

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$26.001

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$21.321

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$26.001

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IDEA Electronic Components Group

UK . 859 parts In-Stock

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$26.001

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$24.701

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$23.401

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$26.001

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Corohmni

South Africa . 185 parts In-Stock

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$26.237

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Ampacity Inc.

Singapore . 1,474 parts In-Stock

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$30.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,601 parts In-Stock

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GreenTree Electronics

Israel . 4,825 parts In-Stock

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Argo Parts USA

USA . 3,601 parts In-Stock

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DigiPath Technology Company

USA . 1,219 parts In-Stock

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Microchip USA

USA . 1,129 parts In-Stock

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Continental Prestige Electronics

USA . 704 parts In-Stock

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Advanced Electronics

New Zealand . 269 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC7553IRGTTG4 Digital-to-Analog Converter. Crafted by a renowned manufacturer, this high-quality chip is designed to deliver exceptional performance and reliability in a variety of applications. With a maximum analog output voltage of 5.5V and a fast settling time of just 5us, this converter offers unparalleled accuracy and speed. Whether you're working on industrial automation, telecommunications, or audio equipment, the DAC7553IRGTTG4 provides the value, benefits, and advantages you need to take your projects to the next level. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

The high maximum analog output voltage allows for a wide range of output signals, making this product versatile for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making this product suitable for rugged environments.

Surface Mount: YES

The surface mount capability makes this product easy to integrate onto circuit boards, saving space and simplifying the assembly process.

No. of Bits: 12

With 12 bits of resolution, this product can provide fine and highly accurate analog output signals, making it ideal for precision applications.

Maximum Settling Time: 5 us

The fast settling time of 5 microseconds ensures minimal delay in providing stable output signals, making this product suitable for real-time applications.

Power Supplies (V): 3/5

The ability to operate on both 3V and 5V power supplies gives flexibility in power source selection, making this product versatile for different system requirements.

No. of Terminals: 16

The ample number of terminals allows for easy connectivity and integration with other components, making this product user-friendly in system design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer options for different mounting preferences and thermal management needs, making this product adaptable to diverse design requirements.

Nominal Settling Time (tstl): 5 us

The consistent settling time of 5 microseconds ensures reliable performance, making this product suitable for high-speed applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows this product to withstand harsh environmental conditions, making it reliable in extreme temperature settings.

Technical Specifications

Digital-to-Analog Converters DAC7553IRGTTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

440 μA

Maximum Settling Time:

5 µs

Sample Rate:

1 MHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Trade Compliance

DAC7553IRGTTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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