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DAC5682ZEVM

Texas Instruments

DAC5682ZEVM by Texas Instruments

DAC5682ZEVM by Texas Instruments is a Development Board with 2x16-bit DACs, 1GSPS sampling rate, and 10.4ns settling time. It uses the DAC5682Z IC for current output applications in evaluating Digital to Analog Converters (DACs).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,488 parts In-Stock

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Digiode

USA . 204 parts In-Stock

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Native Components

USA . 881 parts In-Stock

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$0.114

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$0.109

881

$0.114

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$0.109

Northwest PG Solutions

USA . 1,584 parts In-Stock

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$0.125

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$0.110

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$0.125

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AZTECH Wire

Italy . 734 parts In-Stock

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$16.212

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734

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Semicontronic

India . 417 parts In-Stock

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$25.100

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$24.472

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$24.347

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417

$25.100

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One Stop Electronics

USA . 691 parts In-Stock

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$126.100

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691

$126.100

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

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$201.100

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$201.100

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ChromeModa Solutions

Germany . 6,050 parts In-Stock

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DigiPath Technology Company

USA . 1,891 parts In-Stock

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Corphita

USA . 1,570 parts In-Stock

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IDEA Electronic Components Group

UK . 490 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Parana Technologies

USA . 81 parts In-Stock

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Unlock the true potential of your projects with the DAC5682ZEVM by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-quality products that deliver exceptional performance. The DAC5682ZEVM is a game-changer in the world of Digital to Analog Converters evaluation boards, offering unmatched precision and reliability. Ideal for a wide range of applications, this powerful tool provides customers with unparalleled value and benefits, making it a must-have for any development project. Elevate your designs with the DAC5682ZEVM and experience the difference today.

Feature Benefit Bullets

Number of DAC's: 2

Having 2 DACs allows for more flexibility and customization in signal output, making this product suitable for applications requiring dual channel operation.

Sampling Rate (Per Second): 1G

With a high sampling rate of 1G per second, this product is ideal for applications that require fast and accurate analog to digital conversion, such as high-speed data acquisition or waveform generation.

Data Interface: Parallel

The parallel data interface enables fast and efficient communication between the DAC and other digital devices, making it a good choice for high-speed data transfer applications.

Settling Time: 10.4 ns

The fast settling time of 10.4 ns ensures that the DAC outputs stable and accurate analog signals quickly, making it suitable for applications that require precise and real-time analog signal generation.

DAC Type: Current

The current DAC type allows for precise control over the output current, making it suitable for applications that require high linearity and accuracy in analog current output.

Technical Specifications

Additional Parts DAC5682ZEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DAC5682ZEVM-ND
296-30864

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

Parallel

Settling Time:

10.4 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

2

Supplied Contents:

Board(s)

Number of Bits:

16

Utilized IC / Part:

DAC5682Z

Package:

Box

Sampling Rate (Per Second):

1G

Base Product Number:

DAC5682

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC5682ZEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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