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DAC5675AEVM

Texas Instruments

DAC5675AEVM by Texas Instruments

DAC5675AEVM by Texas Instruments is a 14-bit DAC Evaluation Board with 400MSPS sampling rate and 20ns settling time. It features a parallel data interface, current DAC type, and utilizes the DAC5675A IC. Ideal for testing high-speed analog signal processing applications.

Median Price

$218.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2 parts In-Stock

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$199.000

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$199.000

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DigiKey

USA . 1 parts In-Stock

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$238.800

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1

$238.800

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Digiode

USA . 4,869 parts In-Stock

1+ parts

$189.050

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4,869

$189.050

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Vyrian

USA . 8,189 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 959 parts In-Stock

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$1.088

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959

$1.088

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Northwest PG Solutions

USA . 1,630 parts In-Stock

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$1.196

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1,630

$1.196

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$169.150

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$169.150

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Semicontronic

India . 2 parts In-Stock

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$169.150

100+ parts

$164.921

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$164.076

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2

$169.150

$164.921

$164.076

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Corphita

USA . 4,688 parts In-Stock

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$179.100

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Corohmni

South Africa . 327 parts In-Stock

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$199.000

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DigiPath Technology Company

USA . 2,306 parts In-Stock

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ChromeModa Solutions

Germany . 1,936 parts In-Stock

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Parana Technologies

USA . 1,026 parts In-Stock

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$0.517

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IDEA Electronic Components Group

UK . 922 parts In-Stock

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Overview

Experience the exceptional quality and superior performance of the DAC5675AEVM by Texas Instruments, a leading manufacturer in the industry. This development board is designed for Digital to Analog Converters (DACs) evaluation and offers unparalleled precision and reliability. Perfect for a wide range of applications, this board provides customers with unmatched value and benefits, making it the ideal choice for any project requiring high-quality analog signal conversion. Elevate your designs with the DAC5675AEVM and experience the difference today!

Feature Benefit Bullets

Number of Bits: 14

With a higher number of bits, this DAC evaluation board provides finer resolution and more accurate representation of analog signals, making it suitable for high-precision applications.

Sampling Rate (Per Second): 400M

The high sampling rate of 400M samples per second ensures that the DAC can accurately reproduce fast-changing analog signals, making it ideal for applications that require real-time signal processing.

Data Interface: Parallel

The parallel data interface allows for efficient and fast communication between the DAC and other components, enabling high-speed data transfer and low latency, making it suitable for time-critical applications.

Settling Time: 20 ns

The fast settling time of 20 ns ensures that the DAC can rapidly reach its final output value after a change in input, making it suitable for applications that require quick response times and minimal signal distortion.

DAC Type: Current

Being a current-output DAC, this board can offer better linearity and accuracy compared to voltage-output DACs, making it a good choice for applications that require precise current control or modulation.

Technical Specifications

Additional Parts DAC5675AEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-30861
DAC5675AEVM-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

Parallel

Settling Time:

20 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

1

Supplied Contents:

Board(s)

Number of Bits:

14

Utilized IC / Part:

DAC5675A

Package:

Box

Sampling Rate (Per Second):

400M

Base Product Number:

DAC5675

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC5675AEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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