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DAC3162EVM

Texas Instruments

DAC3162EVM by Texas Instruments

DAC3162EVM by Texas Instruments features 2 DACs with 12-bit resolution and a sampling rate of 500MSPS. It supports CMOS, LVDS, and Parallel data interfaces for fast signal processing applications. Ideal for evaluating DAC3162 IC in current output configurations with a settling time of 10ns.

Median Price

$218.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Texas Instruments

USA . 16 parts In-Stock

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$199.000

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DigiKey

USA . 2 parts In-Stock

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$238.800

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$238.800

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Digiode

USA . 3,734 parts In-Stock

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$189.050

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3,734

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$192.310

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$144.230

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$125.000

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$192.310

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Vyrian

USA . 2,134 parts In-Stock

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Odintec Ltd.

Israel . 1 parts In-Stock

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Native Components

USA . 789 parts In-Stock

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$1.830

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789

$1.830

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Northwest PG Solutions

USA . 164 parts In-Stock

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$2.013

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$2.013

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Corphita

USA . 4,558 parts In-Stock

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$179.100

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ChromeModa Solutions

Germany . 2,630 parts In-Stock

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2,630

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DigiPath Technology Company

USA . 1,843 parts In-Stock

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IDEA Electronic Components Group

UK . 1,449 parts In-Stock

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Parana Technologies

USA . 347 parts In-Stock

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$0.727

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347

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$0.727

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Overview

Unlock the full potential of your designs with the Texas Instruments DAC3162EVM. Known for its exceptional quality and reliability, Texas Instruments has delivered yet again with this top-of-the-line Development Board. Perfect for a wide range of applications, this Evaluation Board offers unparalleled precision and performance. Experience the value and benefits of seamless integration, efficient operation, and superior results that the DAC3162EVM provides. Elevate your projects to new heights with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Number of DAC's: 2

Having 2 DACs allows for dual-channel operation, providing more flexibility and options for the user.

Number of Bits: 12

The higher number of bits allows for finer resolution and greater accuracy in converting digital signals to analog, making this product suitable for applications requiring precise analog output.

Sampling Rate (Per Second): 500M

With a high sampling rate of 500M, this product can accurately capture and process analog signals at a fast pace, making it ideal for high-speed applications.

Data Interface: CMOS, LVDS, Parallel

Supporting multiple data interfaces allows for compatibility with different systems and makes it easier to integrate this product into various applications.

Settling Time: 10 ns

The fast settling time of 10 ns ensures that the output of the DAC stabilizes quickly, reducing distortion and improving the overall performance of the product.

DAC Type: Current

Being a current DAC allows for high-speed and high-accuracy signal conversion, making it suitable for applications where precision and speed are crucial.

Supplied Contents: Board(s)

Providing the necessary board(s) for evaluation simplifies the setup process and allows users to start testing and assessing the product immediately.

Technical Specifications

Additional Parts DAC3162EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DAC3162EVM-ND
296-30215

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

CMOS, LVDS, Parallel

Settling Time:

10 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

2

Supplied Contents:

Board(s)

Number of Bits:

12

Utilized IC / Part:

DAC3162

Package:

Box

Sampling Rate (Per Second):

500M

Base Product Number:

DAC3162

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC3162EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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