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DAC3154EVM

Texas Instruments

DAC3154EVM by Texas Instruments

DAC3154EVM by Texas Instruments features 2x10-bit DACs with 500MSPS sampling rate. It supports CMOS, LVDS, and Parallel data interfaces with a settling time of 11ns. Ideal for evaluating Current DAC3154 IC in applications requiring high-speed analog signal generation.

Median Price

$499.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1 parts In-Stock

1+ parts

$63.930

100+ parts

-

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1

$63.930

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Texas Instruments

USA . 20 parts In-Stock

1+ parts

$499.000

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20

$499.000

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Mouser Electronics

USA . 1 parts In-Stock

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$601.410

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1

$601.410

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Distributors (In-Stock)

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Digiode

USA . 4,657 parts In-Stock

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$474.050

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4,657

$474.050

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Vyrian

USA . 5,832 parts In-Stock

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5,832

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Distributors (Availability)

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Native Components

USA . 79 parts In-Stock

1+ parts

$7.940

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79

$7.940

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Northwest PG Solutions

USA . 2,244 parts In-Stock

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$8.734

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$7.861

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2,244

$8.734

$7.861

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Semicontronic

India . 7 parts In-Stock

1+ parts

$424.150

100+ parts

$413.546

1k+ parts

$411.426

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7

$424.150

$413.546

$411.426

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Corphita

USA . 3,098 parts In-Stock

1+ parts

$449.100

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3,098

$449.100

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

$499.000

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376

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$923.150

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7

$923.150

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ChromeModa Solutions

Germany . 5,690 parts In-Stock

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5,690

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DigiPath Technology Company

USA . 1,949 parts In-Stock

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1,949

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Parana Technologies

USA . 1,792 parts In-Stock

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$0.935

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1,792

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$0.935

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IDEA Electronic Components Group

UK . 913 parts In-Stock

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913

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock the full potential of your designs with the Texas Instruments DAC3154EVM. As a trusted leader in the industry, Texas Instruments ensures top-notch quality and reliability. This development board offers endless possibilities for digital to analog conversion applications, providing unparalleled precision and performance. Discover the value and benefits of integrating this innovative solution into your projects today and revolutionize your creations. Elevate your designs with the DAC3154EVM and experience the difference.

Feature Benefit Bullets

Number of DAC's: 2

Having 2 DAC's allows for flexibility in signal processing, making this product suitable for more complex applications.

Sampling Rate (Per Second): 500M

High sampling rate of 500M per second ensures accurate and fast conversion of digital signals to analog signals.

Data Interface: CMOS, LVDS, Parallel

Multiple data interface options (CMOS, LVDS, Parallel) provide compatibility with various systems and allow for easy integration.

Settling Time: 11 ns

Fast settling time of 11 ns ensures that the output signal stabilizes quickly, reducing distortion and improving overall performance.

DAC Type: Current

Current DAC type offers precise control over the output current, making this product suitable for applications requiring high accuracy.

Supplied Contents: Board(s)

The inclusion of board(s) in the package provides a ready-to-use solution for testing and prototyping, saving time and effort in setup.

Technical Specifications

Additional Parts DAC3154EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-36403

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

CMOS, LVDS, Parallel

Settling Time:

11 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

2

Supplied Contents:

Board(s)

Number of Bits:

10

Utilized IC / Part:

DAC3154

Package:

Box

Sampling Rate (Per Second):

500M

Base Product Number:

DAC3154

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC3154EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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