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CLC417AJP

Texas Instruments

CLC417AJP by Texas Instruments

The Texas Instruments CLC417AJP is a dual-buffer amplifier with 52MHz bandwidth, 250V/us slew rate, and 8000uV max input offset voltage. It operates b/w -40 to 85 °C and has a supply current of 9.8mA. Ideal for applications requiring high-speed signal buffering in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,716 parts In-Stock

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9,716

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Digiode

USA . 4,327 parts In-Stock

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4,327

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Anansix

USA . 1,973 parts In-Stock

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1,973

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Lakeland Logistics Inc

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,028 parts In-Stock

1+ parts

$1.774

100+ parts

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$2.339

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2,028

$1.774

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$2.339

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DigiPath Technology Company

USA . 425 parts In-Stock

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$1.953

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$1.797

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425

$1.953

$1.797

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ChromeModa Solutions

Germany . 1,274 parts In-Stock

1+ parts

$1.993

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$1.634

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1,274

$1.993

$1.634

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IDEA Electronic Components Group

UK . 697 parts In-Stock

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$1.993

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$1.794

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697

$1.993

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One Stop Electronics

USA . 505 parts In-Stock

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$2.410

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505

$2.410

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Northwest PG Solutions

USA . 1,444 parts In-Stock

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$3.334

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1,444

$3.334

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AZTECH Wire

Italy . 240 parts In-Stock

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$17.725

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240

$17.725

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Corphita

USA . 2,172 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Native Components

USA . 999 parts In-Stock

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$2.940

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999

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$2.940

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Overview

Looking for top-notch performance in buffer amplifiers? Look no further than the CLC417AJP by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers yet again with this dual-function buffer amplifier that offers a nominal bandwidth of 52 MHz and a minimum slew rate of 250 V/us. Ideal for a wide range of applications, this rectangular-shaped amplifier provides customers with exceptional value, reliability, and precision. Upgrade your electronics with the CLC417AJP and experience the advantages that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the buffer amplifier, making it reliable for long-term use.

Maximum Input Offset Voltage: 8000 uV

The low maximum input offset voltage of 8000uV ensures accurate signal amplification without distortion, making it suitable for precision applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly available and easily compatible with various power sources, ensuring easy integration into different systems.

Nominal Bandwidth (3dB): 52 MHz

With a wide nominal bandwidth of 52MHz, the buffer amplifier can handle high-frequency signals with minimal distortion, making it ideal for applications requiring fast signal processing.

Minimum Output Current: 0.02 A

The minimum output current of 0.02A allows the buffer amplifier to drive external loads efficiently, making it suitable for driving various components in a circuit.

Technical Specifications

Buffer Amplifiers CLC417AJP attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

52 MHz

Minimum Slew Rate:

250 V/us

Nominal Slew Rate:

400 V/us

Input Offset Voltage Limit:

8 mV

Operational Characteristics

Maximum Supply Current:

9.8 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-7 V

Lowest Output Current:

20 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Total Terminals:

8

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Standards

JESD-30 Code:

R-PDIP-T8

Packaging and Shipping

Package Shape:

Trade Compliance

CLC417AJP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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