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CLC402ALC

Texas Instruments

CLC402ALC by Texas Instruments

CLC402ALC by Texas Instruments is an Industrial-grade Operational Amplifier (Op Amp) with Surface Mount capability. It features Bipolar technology, Uncased Chip package style, and Upper terminal position. Ideal for applications requiring high-performance amplification in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,542 parts In-Stock

1+ parts

-

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6,542

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Digiode

USA . 4,703 parts In-Stock

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4,703

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Anansix

USA . 2,866 parts In-Stock

1+ parts

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2,866

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 915 parts In-Stock

1+ parts

$1.148

100+ parts

-

1k+ parts

-

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915

$1.148

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Northwest PG Solutions

USA . 1,362 parts In-Stock

1+ parts

$1.263

100+ parts

-

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1,362

$1.263

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Parana Technologies

USA . 1,977 parts In-Stock

1+ parts

$1.872

100+ parts

-

1k+ parts

$2.416

10k+ parts

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1,977

$1.872

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$2.416

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DigiPath Technology Company

USA . 1,497 parts In-Stock

1+ parts

$2.061

100+ parts

$1.896

1k+ parts

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10k+ parts

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1,497

$2.061

$1.896

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ChromeModa Solutions

Germany . 3,664 parts In-Stock

1+ parts

$2.103

100+ parts

$1.724

1k+ parts

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3,664

$2.103

$1.724

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IDEA Electronic Components Group

UK . 2,118 parts In-Stock

1+ parts

$2.103

100+ parts

-

1k+ parts

$1.893

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2,118

$2.103

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$1.893

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One Stop Electronics

USA . 443 parts In-Stock

1+ parts

$2.410

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443

$2.410

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AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$6.763

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876

$6.763

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Corphita

USA . 587 parts In-Stock

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587

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the CLC402ALC operational amplifier. Designed for industrial applications, this surface-mount chip offers superior performance and precision. Whether you're working on audio equipment, medical devices, or industrial automation systems, the CLC402ALC delivers unmatched value and flexibility. Trust Texas Instruments for cutting-edge technology and innovative solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly.

Package Style (Meter): UNCASED CHIP

Uncased chip package style offers versatility and customization options for specific application requirements.

Terminal Position: UPPER

Upper terminal position can improve signal integrity and reduce interference, leading to better overall performance.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures reliable operation in harsh environmental conditions, making it suitable for a wide range of industrial applications.

Technology: BIPOLAR

Bipolar technology provides high performance and stable operation, making it ideal for precision applications that require accurate amplification.

Terminal Form: NO LEAD

No lead terminal form simplifies installation and minimizes the risk of solder joints cracking or breaking, enhancing durability and reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and commonly used in various electronic circuits for amplification, filtering, and signal conditioning, making this product a versatile choice for many applications.

Technical Specifications

Operational Amplifiers (Op Amps) CLC402ALC attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

X-XUUC-N

Packaging and Shipping

Package Code:

DIE

Package Style:

Uncased Chip

Trade Compliance

CLC402ALC Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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