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CDCR61APWRG4

Texas Instruments

CDCR61APWRG4 by Texas Instruments

CDCR61APWRG4 clock generator by Texas Instruments operates at a max output frequency of 400 MHz with supply voltages of 1.8V and 3.3V. It is designed for industrial applications, featuring a small outline package style and dual terminal position for easy integration in various systems. This CMOS technology-based peripheral IC is ideal for processor-specific requirements in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,323 parts In-Stock

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3,323

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Vyrian

USA . 2,327 parts In-Stock

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2,327

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Florida Circuit

USA . 419 parts In-Stock

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419

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Distributors (Availability)

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Native Components

USA . 637 parts In-Stock

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$0.572

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637

$0.572

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Northwest PG Solutions

USA . 52 parts In-Stock

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$0.629

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52

$0.629

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AZTECH Wire

Italy . 376 parts In-Stock

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$6.441

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376

$6.441

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One Stop Electronics

USA . 1,494 parts In-Stock

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$15.000

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1,494

$15.000

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Parana Technologies

USA . 1,014 parts In-Stock

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$49.796

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$49.796

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DigiPath Technology Company

USA . 1,781 parts In-Stock

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$54.832

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1,781

$54.832

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ChromeModa Solutions

Germany . 1,076 parts In-Stock

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$55.951

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$45.880

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1,076

$55.951

$45.880

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IDEA Electronic Components Group

UK . 967 parts In-Stock

1+ parts

$55.951

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$53.153

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$50.356

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967

$55.951

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$50.356

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Corohmni

South Africa . 945 parts In-Stock

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$65.167

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945

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Microchip USA

USA . 4,530 parts In-Stock

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Corphita

USA . 4,067 parts In-Stock

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Overview

Elevate your electronic designs with the CDCR61APWRG4 clock generator by Texas Instruments. Crafted with precision and expertise, this clock generator offers seamless integration, high performance, and reliable functionality for a wide range of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile component provides the accuracy and stability you need. Trust in Texas Instruments to deliver exceptional quality and value with the CDCR61APWRG4 clock generator.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection for the internal components of the clock generator.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V allows for flexibility in power supply options and compatibility with various systems.

Maximum Output Clock Frequency: 400 MHz

The high maximum output clock frequency of 400 MHz enables high-speed data processing and performance.

Technology: CMOS

The CMOS technology ensures low power consumption and reliable operation for efficient use.

Nominal Primary Clock/Crystal Frequency: 18.75 MHz

The specific nominal primary clock/crystal frequency of 18.75 MHz makes this clock generator suitable for applications requiring this frequency.

Technical Specifications

Clock Generators CDCR61APWRG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

400 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Nominal Primary Clock/Crystal Frequency:

18.75 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CDCR61APWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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