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CDCE906-706PERFEVM

Texas Instruments

CDCE906-706PERFEVM by Texas Instruments

CDCE906-706PERFEVM by Texas Instruments is a Timing Clock Generator board for CDCE906 and CDCE706 ICs. It comes in a Box package with Evaluation Boards for Development Kits. The MSL level is 1, making it suitable for various applications requiring clock generation functionalities.

Median Price

$178.800

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$178.800

100+ parts

-

1k+ parts

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10k+ parts

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4

$178.800

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Distributors (In-Stock)

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Digiode

USA . 1,500 parts In-Stock

1+ parts

$169.860

100+ parts

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1,500

$169.860

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Vyrian

USA . 6,062 parts In-Stock

1+ parts

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100+ parts

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6,062

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Euro-Tech

UK . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 2,184 parts In-Stock

1+ parts

$3.041

100+ parts

-

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2,184

$3.041

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Corphita

USA . 1,681 parts In-Stock

1+ parts

$160.920

100+ parts

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1,681

$160.920

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Parana Technologies

USA . 2,308 parts In-Stock

1+ parts

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1k+ parts

$0.799

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2,308

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$0.799

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IDEA Electronic Components Group

UK . 1,477 parts In-Stock

1+ parts

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1,477

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Native Components

USA . 874 parts In-Stock

1+ parts

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1k+ parts

$2.682

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874

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$2.682

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ChromeModa Solutions

Germany . 537 parts In-Stock

1+ parts

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537

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DigiPath Technology Company

USA . 48 parts In-Stock

1+ parts

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48

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Perfect Parts

USA . 2 parts In-Stock

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2

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Overview

Elevate your projects with the CDCE906-706PERFEVM by Texas Instruments, a top-quality timing solution that serves as a reliable clock generator. Designed with precision and expertise, this product offers unmatched performance and versatility for various applications. The CDCE906-706PERFEVM is perfect for developers and engineers looking to optimize their designs with ease. Unlock new possibilities and enhance your projects with this exceptional evaluation board from Texas Instruments. Experience the value and benefits it brings to your work today.

Feature Benefit Bullets

Other Names: CDCE906706PERFEVM, 296-30828, CDCE906-706PERFEVM-ND

Multiple names make it easily identifiable in various databases and for ordering purposes.

Category: Development Boards, Kits, Programmers; Evaluation Boards; Evaluation and Demonstration Boards and Kits

Versatile usage in development projects and evaluation purposes.

Package: Box

Provides a convenient and protective packaging for the product.

Type: Timing

Specifically designed for clock generation purposes, ensuring accurate timing functions.

Function: Clock Generator

Focuses on generating clock signals efficiently and reliably.

Utilized IC / Part: CDCE906, CDCE706

Incorporates high-quality integrated circuits for performance and reliability.

Supplied Contents: Board(s)

Includes necessary boards for immediate use or integration into existing systems.

Base Product Number: CDCE906

Built upon a reliable and established base product for consistency in performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environmental conditions without concern for moisture damage.

Technical Specifications

Additional Parts CDCE906-706PERFEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

CDCE906706PERFEVM
296-30828
CDCE906-706PERFEVM-ND

Function:

Clock Generator

Type:

Timing

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

CDCE906, CDCE706

Package:

Box

Standard Package:

1

Base Product Number:

CDCE906

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

CDCE906-706PERFEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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