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CDCDLP223PWRG4

Texas Instruments

CDCDLP223PWRG4 by Texas Instruments

The Texas Instruments CDCDLP223PWRG4 clock generator operates at a max output frequency of 300 MHz with a supply voltage range of 3V to 3.6V. This industrial-grade device, featuring a small outline package style, is suitable for applications requiring precise timing and synchronization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,147 parts In-Stock

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Vyrian

USA . 2,596 parts In-Stock

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2,596

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Distributors (Availability)

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Native Components

USA . 853 parts In-Stock

1+ parts

$0.335

100+ parts

-

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$0.322

853

$0.335

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$0.322

Northwest PG Solutions

USA . 176 parts In-Stock

1+ parts

$0.369

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-

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$0.325

176

$0.369

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$0.325

One Stop Electronics

USA . 1,355 parts In-Stock

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$7.000

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1,355

$7.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$15.795

100+ parts

$14.373

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$12.952

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-

3,000

$15.795

$14.373

$12.952

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AZTECH Wire

Italy . 491 parts In-Stock

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$17.532

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491

$17.532

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Corohmni

South Africa . 545 parts In-Stock

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$29.573

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545

$29.573

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Parana Technologies

USA . 1,270 parts In-Stock

1+ parts

$48.286

100+ parts

$4,484.093

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$43.457

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1,270

$48.286

$4,484.093

$43.457

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DigiPath Technology Company

USA . 138 parts In-Stock

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$53.169

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138

$53.169

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IDEA Electronic Components Group

UK . 526 parts In-Stock

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$54.254

100+ parts

$51.541

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$48.829

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526

$54.254

$51.541

$48.829

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ChromeModa Solutions

Germany . 217 parts In-Stock

1+ parts

$54.254

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$44.488

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217

$54.254

$44.488

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Component Stockers USA

USA . 593 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 7,019 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,679 parts In-Stock

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Lixinc

USA . 4,517 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,605 parts In-Stock

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Microchip USA

USA . 187 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments CDCDLP223PWRG4 Clock Generator. Crafted with precision and expertise, this clock generator is a testament to TI's commitment to quality and innovation. Perfect for a wide range of applications, this device offers customers unparalleled value, reliability, and performance. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this clock generator lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this clock generator is easy to install on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power supply options, making it compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient use of space on the PCB, maximizing component density for compact designs.

Maximum Output Clock Frequency: 300 MHz

With a high maximum output clock frequency of 300MHz, this clock generator can support high-performance applications that require fast data processing.

Power Supplies (V): 3.3

The 3.3V power supply capability is a standard voltage level in many electronic devices, ensuring compatibility with various systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and I/O options, enabling versatile configuration possibilities for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, making it suitable for compact and densely populated designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3V ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this clock generator can reliably operate in harsh industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extremely cold conditions, making it suitable for various operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexible PCB layout options, accommodating different design requirements and constraints.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm enables a slim profile for the clock generator, ideal for space-constrained applications.

Width: 4.4 mm

The compact width of 4.4mm ensures efficient space utilization on the PCB, contributing to overall system miniaturization.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing processes, optimizing product quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable soldering and rework processes, ensuring durable connections between the clock generator and the PCB.

Length: 6.5 mm

The compact length of 6.5mm allows for efficient PCB layout and placement, contributing to space-saving designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades, this clock generator can withstand harsh operating conditions in industrial settings, ensuring long-term durability and reliability.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator with additional peripheral IC capabilities provides versatile functionality for various system requirements, offering enhanced performance and flexibility.

Technology: CMOS

Utilizing CMOS technology, this clock generator offers low power consumption, fast operation, and high noise immunity, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form enables easy soldering and robust mechanical connections, ensuring reliable performance and long-term durability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable power delivery for the clock generator, ensuring consistent and reliable operation in various systems.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65mm, this clock generator allows for precise and compact PCB layout, facilitating high-density designs and efficient space utilization.

Nominal Primary Clock/Crystal Frequency: 20 MHz

The nominal primary clock/crystal frequency of 20MHz provides a standard reference signal for clock synchronization, ensuring accurate timing and performance in electronic systems.

Technical Specifications

Clock Generators CDCDLP223PWRG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

300 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

CDCDLP223PWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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