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CD74HCT4538MG4

Texas Instruments

CD74HCT4538MG4 by Texas Instruments

CD74HCT4538MG4 by Texas Instruments is a Prescaler & Multivibrator IC with 2 functions, operating at 5V. It features a propagation delay of 83ns, MILITARY temperature grade, and CMOS technology. This small outline package with gull wing terminals is ideal for applications requiring precise timing and signal processing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,151 parts In-Stock

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Digiode

USA . 2,606 parts In-Stock

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2,606

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Pegasus Components GmbH

Germany . 29 parts In-Stock

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29

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Distributors (Availability)

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AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$9.627

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352

$9.627

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Ampacity Inc.

Singapore . 1,537 parts In-Stock

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$14.000

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$14.000

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One Stop Electronics

USA . 397 parts In-Stock

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$25.000

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397

$25.000

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Parana Technologies

USA . 1,830 parts In-Stock

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$30.059

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$66.578

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$30.059

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$66.578

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$33.774

100+ parts

$32.085

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$30.397

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2,012

$33.774

$32.085

$30.397

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ChromeModa Solutions

Germany . 420 parts In-Stock

1+ parts

$33.774

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$27.695

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420

$33.774

$27.695

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Corphita

USA . 504 parts In-Stock

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504

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DigiPath Technology Company

USA . 79 parts In-Stock

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$30.451

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79

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$30.451

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Experience unmatched quality and reliability with the CD74HCT4538MG4 by Texas Instruments, a leading manufacturer in the industry. This prescaler & multivibrator offers exceptional performance and versatility, making it perfect for a wide range of applications. From precision timing to frequency division, this product delivers unparalleled value to customers seeking high-quality electronic components. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and labor costs.

No. of Functions: 2

Provides multiple functions in a single component, saving space on the PCB.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage, ensuring compatibility with many systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and military applications.

Technology: CMOS

Uses CMOS technology which ensures low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Prescaler & Multivibrators CD74HCT4538MG4 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

83 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT4538MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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