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CD74HC4066QPWRQ1

Texas Instruments

CD74HC4066QPWRQ1 by Texas Instruments

CD74HC4066QPWRQ1 by Texas Instruments is a 4-channel SPST analog switch with an on-state resistance of 70Ω and operating voltage range of 2V to 10V. With a bandwidth of 200MHz, it is ideal for applications requiring high-speed signal switching in temperature ranges from -55°C to 125°C. This IC is commonly used in interface circuits, multiplexers, and demultiplexers due to its low leakage current and channel capacitance of 10pF.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,268 parts In-Stock

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Digiode

USA . 4,409 parts In-Stock

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Native Components

USA . 751 parts In-Stock

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$1.515

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Northwest PG Solutions

USA . 374 parts In-Stock

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$1.666

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AZTECH Wire

Italy . 318 parts In-Stock

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$5.381

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One Stop Electronics

USA . 403 parts In-Stock

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$86.100

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Semicontronic

India . 966 parts In-Stock

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$141.100

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$137.572

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$136.867

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966

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Ampacity Inc.

Singapore . 850 parts In-Stock

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$150.100

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Corphita

USA . 3,634 parts In-Stock

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ChromeModa Solutions

Germany . 3,006 parts In-Stock

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DigiPath Technology Company

USA . 2,318 parts In-Stock

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Parana Technologies

USA . 1,155 parts In-Stock

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Microchip USA

USA . 917 parts In-Stock

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IDEA Electronic Components Group

UK . 337 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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Overview

Discover the ultimate solution for your integrated circuit needs with the CD74HC4066QPWRQ1 by Texas Instruments. Designed with precision and quality in mind, this analog switch offers unparalleled performance and reliability for a variety of applications. Whether you're looking to improve signal processing or enhance your electronic design, this product delivers exceptional value and benefits. Trust in Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Other Names: 296-CD74HC4066QPWRQ1

This specific part number helps identify the product easily in inventory and ordering systems.

Category: Integrated Circuits (ICs) / Interface / Analog Switches, Multiplexers, Demultiplexers

This product falls under the category of integrated circuits for interface applications, making it suitable for use in analog switches, multiplexers, and demultiplexers.

Packaging: Bulk

Bulk packaging allows for cost-effective purchasing of multiple units at once, suitable for production or stocking purposes.

Switch Circuit: SPST - NO

Single Pole, Single Throw (SPST) configuration with normally open (NO) state provides simple on/off control for each channel.

Multiplexer/Demultiplexer Circuit: 1:1

1:1 multiplexer/demultiplexer circuit ratio ensures straightforward signal routing between input and output channels.

On-State Resistance (Max): 70Ohm

Low on-state resistance minimizes signal loss and distortion when the switch is closed, ensuring efficient signal transmission.

Channel-to-Channel Matching (ΔRon): 500mOhm

Relatively low channel-to-channel resistance matching ensures consistent performance across all channels, critical for precision applications.

Voltage - Supply, Single (V+): 2V ~ 10V

Wide voltage supply range allows for flexibility in various application environments, accommodating different power sources.

-3db Bandwidth: 200MHz

High bandwidth capability supports fast signal switching and processing, suitable for high-frequency applications.

Channel Capacitance (CS(off), CD(off)): 10pF, 10pF

Low channel capacitance minimizes signal distortion and interference, ensuring accurate signal transmission.

Current - Leakage (IS(off)) (Max): 100nA

Low leakage current ensures minimal power consumption when the switch is in the off state, improving overall energy efficiency.

Operating Temperature: -55°C ~ 125°C (TA)

Wide operating temperature range allows for reliable performance in extreme temperature conditions, suitable for industrial or automotive applications.

Mounting Type: Surface Mount

Surface mount design enables easy and secure installation on PCBs, saving space and simplifying assembly processes.

Package / Case: 14-TSSOP (0.173", 4.40mm Width)

Thin Shrink Small Outline Package (TSSOP) with small width facilitates compact PCB layouts and enables high-density circuit designs.

Supplier Device Package: 14-TSSOP

Matching supplier device package ensures compatibility with recommended assembly and handling guidelines, ensuring product reliability.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Unlimited moisture sensitivity level simplifies storage and handling requirements, allowing for convenient use in various manufacturing environments.

Technical Specifications

Additional Parts CD74HC4066QPWRQ1 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-CD74HC4066QPWRQ1

Operating Temperature:

-55°C ~ 125°C (TA)

Category:

Integrated Circuits (ICs)
Interface Analog Switches, Multiplexers, Demultiplexers

Current - Leakage (IS(off)) (Max):

100nA

-3db Bandwidth:

200MHz

Mounting Type:

Surface Mount

Supplier Device Package:

14-TSSOP

Standard Package:

1

Voltage - Supply, Single (V+):

2V ~ 10V

Channel-to-Channel Matching (ΔRon):

500mOhm

Channel Capacitance (CS(off), CD(off)):

10pF, 10pF

Package / Case:

14-TSSOP (0.173", 4.40mm Width)

On-State Resistance (Max):

70Ohm

Switch Circuit:

SPST - NO

Packaging:

Bulk

Multiplexer/Demultiplexer Circuit:

1:1

Number of Circuits:

4

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

CD74HC4066QPWRQ1 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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