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CD74HC221E

Texas Instruments

CD74HC221E by Texas Instruments

CD74HC221E by Texas Instruments is a CMOS dual-function IC with 2 bits, 16 terminals, and a propagation delay of 315 ns. It operates b/w -55 to 125 °C and has a supply voltage range of 2-6 V. Ideal for military-grade applications requiring precise timing control in compact electronic systems.

Median Price

$0.535

Lifecycle Status

Suppliers In-Stock

49

In-Stock Inventory

1k+

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Arrow

USA . 535 parts In-Stock

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Mouser Electronics

USA . 354 parts In-Stock

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Rochester

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Verical

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Chip1Stop

Japan . 645 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Digiode

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Voyager Components

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American Microsemiconductor Inc.

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Component Electronics Inc.

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Forefront Electronics and Design

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Bristol Electronics

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Semicontronic

India . 23,621 parts In-Stock

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$0.260

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$0.254

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Argo Parts USA

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Continental Prestige Electronics

USA . 17 parts In-Stock

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$0.299

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Component Stockers USA

USA . 143,912 parts In-Stock

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$0.320

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$0.310

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$0.240

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Corphita

USA . 2,847 parts In-Stock

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Microchip USA

USA . 6,134 parts In-Stock

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Parana Technologies

USA . 1,566 parts In-Stock

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$12.897

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$1,197.681

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$11.607

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DigiPath Technology Company

USA . 889 parts In-Stock

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$14.201

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$13.065

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ChromeModa Solutions

Germany . 4,351 parts In-Stock

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IDEA Electronic Components Group

UK . 531 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,584 parts In-Stock

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Supply Digital

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Metaverse IC Inc.

Canada . 253 parts In-Stock

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Overview

Unlock the power of precision with the CD74HC221E by Texas Instruments. Crafted with the highest quality materials and cutting-edge technology, this Prescaler & Multivibrator is designed to exceed expectations. With its versatile applications and reliable performance, this product offers unparalleled value and benefits to customers seeking optimal functionality in their projects. Trust in Texas Instruments to deliver excellence with the CD74HC221E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Functions: 2

Offers multiple functions in a single component, making it versatile and cost-effective for various applications.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal voltage supply for efficient performance and reliability.

Propagation Delay (tpd): 315 ns

Fast propagation delay allows for quick signal processing and response times.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, making it suitable for a wide range of environments and applications.

Minimum Operating Temperature: -55 °C

Can function in extremely cold temperatures, increasing its versatility and usability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Prescaler & Multivibrators CD74HC221E attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

NON-RETRIGGERABLE

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

2

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

315 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HC221E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-2227, 5962014532227

NIIN

014532227

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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