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CD4053BPWRE4

Texas Instruments

CD4053BPWRE4 by Texas Instruments

CD4053BPWRE4 by Texas Instruments is a CMOS multiplexer with 3 functions, operating at -55 to 125 °C. It has a max on-state resistance of 1050 ohm and nominal off-state isolation of 40 dB. Ideal for military-grade applications requiring low power consumption and precise signal switching in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,702 parts In-Stock

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Digiode

USA . 4,572 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Parana Technologies

USA . 1,507 parts In-Stock

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$3.321

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$3.844

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1,507

$3.321

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$3.844

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DigiPath Technology Company

USA . 1,432 parts In-Stock

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$3.657

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1,432

$3.657

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ChromeModa Solutions

Germany . 4,788 parts In-Stock

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$3.732

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$3.060

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IDEA Electronic Components Group

UK . 1,495 parts In-Stock

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$3.732

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$3.359

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$3.732

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$3.359

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Ampacity Inc.

Singapore . 408 parts In-Stock

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$5.500

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408

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One Stop Electronics

USA . 1,238 parts In-Stock

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$7.500

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$7.500

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Semicontronic

India . 241 parts In-Stock

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$7.500

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$7.312

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$7.275

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Corohmni

South Africa . 65 parts In-Stock

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$7.571

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AZTECH Wire

Italy . 704 parts In-Stock

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$8.031

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QUARKTWIN TECHNOLOGY LTD

USA . 9,372 parts In-Stock

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Microchip USA

USA . 6,092 parts In-Stock

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Argo Parts USA

USA . 4,165 parts In-Stock

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Corphita

USA . 3,927 parts In-Stock

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Continental Prestige Electronics

USA . 911 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Overview

Upgrade your electronic circuits with the high-quality CD4053BPWRE4 multiplexer and switch by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch products that guarantee reliability and performance. This versatile component is perfect for a wide range of applications, offering seamless signal routing and control. With its advanced technology and durable construction, the CD4053BPWRE4 provides exceptional value, efficiency, and precision to meet all your design needs. Experience the difference with Texas Instruments and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and labor costs.

No. of Functions: 3

Having multiple functions in one device can simplify circuit design and reduce component count, leading to cost savings and improved efficiency.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently and reliably at a standard voltage level commonly used in electronic systems, ensuring compatibility with various setups.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments and ensuring consistent performance under stress.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable in data processing applications.

No. of Channels: 2

Having multiple channels allows for handling multiple signals simultaneously, increasing the versatility and functionality of the product.

Technical Specifications

Multiplexers & Switches CD4053BPWRE4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage (Vsup):

-5 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

720 ns

Maximum Switch-on Time:

720 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

CD4053BPWRE4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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