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CD4024BF

Texas Instruments

CD4024BF by Texas Instruments

CD4024BF by Texas Instruments is a 7-bit digital counter with a propagation delay of 160 ns. It operates on a nominal voltage of 5V and has a max frequency of 3.5 MHz. This CMOS technology device is suitable for military-grade applications requiring asynchronous operation and negative edge triggering.

Median Price

$15.110

Lifecycle Status

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25

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Rochester

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Arrow

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TEDSS.com

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Digiode

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ICP Electronique

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Andel Nordic

Denmark . 382 parts In-Stock

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$4.832

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Parana Technologies

USA . 1,293 parts In-Stock

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$8.408

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

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ChromeModa Solutions

Germany . 344 parts In-Stock

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AZTECH Wire

Italy . 896 parts In-Stock

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Corphita

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Ampacity Inc.

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Overview

Enhance your digital circuit designs with the Texas Instruments CD4024BF, a top-quality digital counter that offers reliable performance and precise counting capabilities. Manufactured by industry leader Texas Instruments, this product is built to last with ceramic and glass-sealed packaging, ensuring durability and longevity. Ideal for a wide range of applications, this digital counter delivers unmatched value and benefits to customers looking for high-performance components. Upgrade your projects with the CD4024BF and experience the advantages of using top-tier technology in your designs.

Feature Benefit Bullets

No. of Bits: 7

Having 7 bits allows for a wide range of counting possibilities, making this product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most electronic systems, ensuring easy integration.

Maximum Frequency At Nominal Supply: 3500000 Hz

High maximum frequency allows for fast counting operations, making this product suitable for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable.

Operating Temperature Range: -55°C to 125°C

Wide temperature range allows for operation in harsh environments, making this product suitable for military and industrial applications.

Technical Specifications

Digital Counters CD4024BF attributes and parameters. Explore more Digital Counters devices from Texas Instruments

Specs

Additional Features:

OUTPUTS FROM 12 STAGES AVAILABLE

Count Direction:

UP

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

Maximum I (ol):

1.5 Amp

Operation Mode:

ASYNCHRONOUS

No. of Bits:

7

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

160 ns

Propagation Delay (tpd):

360 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

24 MHz

Trade Compliance

CD4024BF Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-063-1966, 5962010631966, 5962-99-654-8528, 5962996548528, 5962-99-747-6722, 5962997476722

NIIN

010631966, 996548528, 997476722

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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