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CC2533EMK

Texas Instruments

CC2533EMK by Texas Instruments

CC2533EMK by Texas Instruments is a 2.4GHz Transceiver Evaluation Board for the CC2533. It comes in a Box package and includes Board(s). Ideal for RF development, it supports 802.15.4 applications with unlimited MSL level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,324 parts In-Stock

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Digiode

USA . 177 parts In-Stock

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Native Components

USA . 620 parts In-Stock

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$0.539

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620

$0.539

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Northwest PG Solutions

USA . 461 parts In-Stock

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$0.593

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$0.593

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AZTECH Wire

Italy . 543 parts In-Stock

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$6.396

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543

$6.396

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Component Stockers USA

USA . 8 parts In-Stock

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$143.160

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One Stop Electronics

USA . 582 parts In-Stock

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$170.100

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$170.100

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Semicontronic

India . 1,254 parts In-Stock

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$171.100

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$166.822

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$165.967

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$171.100

$166.822

$165.967

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Ampacity Inc.

Singapore . 1,178 parts In-Stock

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$223.100

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ChromeModa Solutions

Germany . 6,542 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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IDEA Electronic Components Group

UK . 2,304 parts In-Stock

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DigiPath Technology Company

USA . 1,608 parts In-Stock

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Parana Technologies

USA . 742 parts In-Stock

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$1.197

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Corphita

USA . 590 parts In-Stock

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Corohmni

South Africa . 227 parts In-Stock

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227

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Overview

Experience seamless connectivity with the CC2533EMK from Texas Instruments, a leading manufacturer in the industry. This versatile transceiver evaluation board is perfect for development projects and programming tasks, offering a wide range of applications in the field of RF evaluation and development. Unleash the potential of your CC2533 with this essential tool, providing unmatched value, benefits, and advantages to customers looking to enhance their wireless communication solutions. Elevate your projects with the quality and reliability of Texas Instruments, trusted by professionals worldwide.

Feature Benefit Bullets

Other Names: 296-28219

Unique identifier for easy referencing and ordering

Category: Development Boards, Kits, Programmers; Evaluation Boards; RF Evaluation and Development Kits, Boards

This product falls under various categories, indicating its versatility and compatibility with different applications

Package: Box

Comes in a protective packaging for safe transportation and storage

Type: Transceiver; 802.15.4

Utilizes advanced transceiver technology for reliable wireless communication

Frequency: 2.4GHz

Operates on commonly used frequency band for stable wireless connections

For Use With/Related Products: CC2533

Designed to work seamlessly with specific related products for easy integration and compatibility

Supplied Contents: Board(s)

Includes necessary board components for immediate use and testing

Base Product Number: CC2533

Indicates compatibility with specific base product for streamlined development process

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and operated in various environments without risk of moisture damage

Technical Specifications

Additional Parts CC2533EMK attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-28219

Type:

Transceiver; 802.15.4

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

CC2533

Supplied Contents:

Board(s)

Frequency:

2.4GHz

Package:

Box

Standard Package:

1

Base Product Number:

CC2533

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

CC2533EMK Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A992C

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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