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CC1200EMK-420-470

Texas Instruments

CC1200EMK-420-470 by Texas Instruments

CC1200EMK-420-470 by Texas Instruments is an RF transceiver kit in the SimpleLink™ series. It operates at 420MHz to 470MHz frequency range and is designed for use with CC1200 products. This evaluation board is ideal for developing and testing wireless communication applications.

Median Price

$123.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Texas Instruments

USA . 4 parts In-Stock

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$99.000

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DigiKey

USA . 23 parts In-Stock

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$123.750

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Mouser Electronics

USA . 4 parts In-Stock

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$123.750

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Digiode

USA . 1,209 parts In-Stock

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$94.050

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Vyrian

USA . 7,902 parts In-Stock

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$84.150

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Semicontronic

India . 4 parts In-Stock

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$82.046

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$81.626

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Corphita

USA . 2,342 parts In-Stock

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$89.100

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Corohmni

South Africa . 380 parts In-Stock

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Component Stockers USA

USA . 18 parts In-Stock

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$119.420

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ChromeModa Solutions

Germany . 3,824 parts In-Stock

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DigiPath Technology Company

USA . 1,540 parts In-Stock

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Northwest PG Solutions

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Parana Technologies

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IDEA Electronic Components Group

UK . 911 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the CC1200EMK-420-470. This versatile transceiver evaluation board from the SimpleLink™ series is a game-changer in the RF development industry. Perfect for a wide range of applications, this kit offers customers unmatched value and benefits. Whether you're looking to enhance your IoT project or improve your wireless communication system, the CC1200EMK-420-470 is the ideal solution for all your needs. Experience the difference that Texas Instruments can make in your next project today!

Feature Benefit Bullets

Other Names: 296-36406

This specific identification code makes it easy to reference and order the correct product.

Category: Development Boards, Kits, Programmers Evaluation Boards RF Evaluation and Development Kits, Boards

As part of development boards and evaluation kits category, this product allows for easy prototyping and testing of RF communication applications.

Series: SimpleLink™

Being part of the SimpleLink™ series ensures compatibility and interoperability with other products in the series, allowing for a seamless integration into existing projects.

Package: Box

The box packaging provides protection during shipping and storage, keeping the product safe and secure until it is ready for use.

Type: Transceiver, ISM

The transceiver type allows for both transmission and reception of data, while ISM (Industrial, Scientific, Medical) frequency band ensures reliable and interference-free communication.

Frequency: 420MHz ~ 470MHz

This frequency range is suitable for various applications and offers a good balance between coverage and data transfer speed.

For Use With/Related Products: CC1200

Designed to work specifically with CC1200, ensuring seamless integration and optimal performance when used together.

Supplied Contents: Board(s)

Includes necessary board(s) for immediate setup and use, eliminating the need to source additional components separately.

Base Product Number: CC1200

Based on CC1200, a known and reliable product, ensuring the quality and performance of this additional part.

Technical Specifications

Additional Parts CC1200EMK-420-470 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-36406

Series:

SimpleLink™

Type:

Transceiver, ISM

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

CC1200

Supplied Contents:

Board(s)

Frequency:

420MHz ~ 470MHz

Package:

Box

Standard Package:

1

Base Product Number:

CC1200

Moisture Sensitivity Level (MSL):

Not Applicable

Trade Compliance

CC1200EMK-420-470 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A992C

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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