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BQ29414DCTT

Texas Instruments

BQ29414DCTT by Texas Instruments

BQ29414DCTT by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 110°C. It supports supply voltages from 4V to 25V and has a max seated height of 1.3mm. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,852 parts In-Stock

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5,852

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Digiode

USA . 1,365 parts In-Stock

1+ parts

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1,365

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 408 parts In-Stock

1+ parts

$3.500

100+ parts

-

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408

$3.500

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One Stop Electronics

USA . 1,296 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,296

$5.500

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Semicontronic

India . 675 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

675

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$12.101

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272

$12.101

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Parana Technologies

USA . 2,202 parts In-Stock

1+ parts

$13.809

100+ parts

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$14.295

10k+ parts

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2,202

$13.809

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$14.295

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DigiPath Technology Company

USA . 2,330 parts In-Stock

1+ parts

$15.206

100+ parts

$13.989

1k+ parts

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2,330

$15.206

$13.989

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ChromeModa Solutions

Germany . 5,775 parts In-Stock

1+ parts

$15.516

100+ parts

$12.723

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5,775

$15.516

$12.723

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IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$15.516

100+ parts

$14.740

1k+ parts

$13.964

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2,269

$15.516

$14.740

$13.964

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Component Stockers USA

USA . 588 parts In-Stock

1+ parts

$99.990

100+ parts

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588

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,339 parts In-Stock

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4,339

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Corphita

USA . 2,264 parts In-Stock

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Northwest PG Solutions

USA . 2,054 parts In-Stock

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Microchip USA

USA . 1,533 parts In-Stock

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1,533

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Native Components

USA . 351 parts In-Stock

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351

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Corohmni

South Africa . 100 parts In-Stock

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100

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the BQ29414DCTT Power Management IC. Designed to optimize power supplies in a range of applications, this compact and versatile device offers exceptional value and performance. With a wide operating temperature range, dual terminal position, and industrial-grade construction, this IC is perfect for demanding environments where precision and efficiency are paramount. Trust Texas Instruments for all your power management needs and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy assembly and space-saving design.

Nominal Supply Voltage (Vsup): 14 V

Optimal supply voltage ensures efficient power management.

No. of Terminals: 8

Sufficient number of terminals for connecting various components in the circuit.

Maximum Operating Temperature: 110 °C

High operating temperature range makes the IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance.

Width (mm): 2.8 mm

Compact width enables space-efficient PCB design.

Minimum Supply Voltage (Vsup): 4 V

Low minimum supply voltage allows for flexible power sourcing options.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environments.

Maximum Supply Current (Isup): 0.003 mA

Low supply current consumption for energy-efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and reliable connections.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density PCB layout.

Maximum Supply Voltage (Vsup): 25 V

High maximum supply voltage supports a wide range of applications.

Technical Specifications

Power Management ICs BQ29414DCTT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4/25

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.003 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.8 mm

Trade Compliance

BQ29414DCTT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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