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BQ24401PWRG4

Texas Instruments

BQ24401PWRG4 by Texas Instruments

BQ24401PWRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage of 4-6V, and peak reflow temp of 260°C. It is used in power supply support circuits for applications requiring a compact design and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,563 parts In-Stock

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Digiode

USA . 837 parts In-Stock

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837

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Semi Source

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393

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One Stop Electronics

USA . 1,330 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 1,417 parts In-Stock

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$6.330

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$587.807

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$5.697

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DigiPath Technology Company

USA . 399 parts In-Stock

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$6.970

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$6.412

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399

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ChromeModa Solutions

Germany . 2,534 parts In-Stock

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$7.112

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$5.832

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IDEA Electronic Components Group

UK . 485 parts In-Stock

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$7.112

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$6.401

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485

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AZTECH Wire

Italy . 775 parts In-Stock

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$12.331

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Component Stockers USA

USA . 773 parts In-Stock

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$99.990

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Corphita

USA . 2,561 parts In-Stock

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Microchip USA

USA . 1,120 parts In-Stock

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Native Components

USA . 787 parts In-Stock

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Northwest PG Solutions

USA . 718 parts In-Stock

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Overview

Enhance your power management solutions with the BQ24401PWRG4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable Power Management ICs that are essential for a wide range of applications. This small outline, thin profile IC offers customers the advantage of precise power supply support circuitry with adjustable threshold capabilities. With a nominal supply voltage of 5V and a dual terminal position, this IC provides efficient power control in a compact package. Trust Texas Instruments to provide cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Easier and more efficient installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Stable supply voltage ensures consistent performance of the power management IC.

Maximum Operating Temperature: 70 °C

Can operate at higher temperatures without compromising functionality, suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish that offers good conductivity, corrosion resistance, and ensures optimal performance.

Switcher Config: BUCK

Efficient step-down voltage regulation, reducing power loss and improving overall energy efficiency.

Adjustable Threshold: YES

Allows for customization and fine-tuning of the operating thresholds as per specific requirements, providing flexibility in use.

Technical Specifications

Power Management ICs BQ24401PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24401PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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