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BQ24272YFFR

Texas Instruments

BQ24272YFFR by Texas Instruments

BQ24272YFFR by Texas Instruments is a Power Management IC with a Buck switcher config. It operates b/w -40 to 85°C, with Vsup ranging from 4.2V to 10V. This IC is ideal for applications requiring power supply management in compact devices due to its very thin profile and fine pitch package style.

Median Price

$7.728

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,542 parts In-Stock

1+ parts

$7.728

100+ parts

$6.300

1k+ parts

$4.200

10k+ parts

-

4,542

$7.728

$6.300

$4.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,987 parts In-Stock

1+ parts

$7.342

100+ parts

-

1k+ parts

-

10k+ parts

-

2,987

$7.342

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Vyrian

USA . 6,586 parts In-Stock

1+ parts

-

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6,586

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,043 parts In-Stock

1+ parts

$4.479

100+ parts

-

1k+ parts

$4.914

10k+ parts

-

1,043

$4.479

-

$4.914

-

DigiPath Technology Company

USA . 1,989 parts In-Stock

1+ parts

$4.932

100+ parts

$4.538

1k+ parts

-

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-

1,989

$4.932

$4.538

-

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$5.033

100+ parts

-

1k+ parts

$4.530

10k+ parts

-

2,016

$5.033

-

$4.530

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ChromeModa Solutions

Germany . 1,897 parts In-Stock

1+ parts

$5.033

100+ parts

$4.127

1k+ parts

-

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-

1,897

$5.033

$4.127

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-

Semicontronic

India . 4,093 parts In-Stock

1+ parts

$6.570

100+ parts

$6.406

1k+ parts

$6.373

10k+ parts

-

4,093

$6.570

$6.406

$6.373

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Corphita

USA . 3,053 parts In-Stock

1+ parts

$6.955

100+ parts

-

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3,053

$6.955

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Corohmni

South Africa . 325 parts In-Stock

1+ parts

$7.728

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325

$7.728

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$8.350

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435

$8.350

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Ampacity Inc.

Singapore . 4,260 parts In-Stock

1+ parts

$14.300

100+ parts

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4,260

$14.300

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Microchip USA

USA . 2,773 parts In-Stock

1+ parts

$15.440

100+ parts

$15.220

1k+ parts

$15.110

10k+ parts

$15.000

2,773

$15.440

$15.220

$15.110

$15.000

Component Stockers USA

USA . 3,611 parts In-Stock

1+ parts

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3,611

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Northwest PG Solutions

USA . 2,162 parts In-Stock

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2,162

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Native Components

USA . 360 parts In-Stock

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360

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Overview

Elevate your power management game with the BQ24272YFFR by Texas Instruments. Designed with precision and quality in mind, this Power Management IC offers unparalleled performance and reliability. Suitable for a wide range of applications, this product provides customers with the ultimate convenience and efficiency. Say goodbye to power supply management issues and hello to seamless operation with the BQ24272YFFR. Experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation in various applications, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design for efficient board space utilization.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package with a very thin profile and fine pitch leads to improved thermal performance and reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin silver copper provides excellent solderability and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position offers easy access for PCB layout and connections.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Power supply management circuit ensures efficient power delivery and protection features for the system.

Minimum Supply Voltage (Vsup): 4.2 V

Low minimum supply voltage allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product can withstand reflow soldering process effectively.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering of the component on the PCB.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and mechanical strength.

Switcher Config: BUCK

Buck switcher configuration offers efficient voltage regulation and power conversion for optimal performance.

Maximum Supply Voltage (Vsup): 10 V

High maximum supply voltage allows for operation in a wide range of power supply applications.

Technical Specifications

Power Management ICs BQ24272YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B49

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ24272YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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