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BQ24270RGET

Texas Instruments

BQ24270RGET by Texas Instruments

BQ24270RGET by Texas Instruments is a Power Management IC with 24 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial applications. With a buck switcher configuration and nickel/palladium/gold terminal finish, it supports supply voltage from 4.2V to 18V.

Median Price

$7.850

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 248 parts In-Stock

1+ parts

$8.990

100+ parts

$7.329

1k+ parts

$4.886

10k+ parts

-

248

$8.990

$7.329

$4.886

-

Arrow

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.672

10k+ parts

-

2,250

-

-

$5.672

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$6.280

1k+ parts

$5.620

10k+ parts

$5.290

1,000

-

$6.280

$5.620

$5.290

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$8.260

1k+ parts

-

10k+ parts

-

1,000

-

$8.260

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.025

10k+ parts

$6.612

1,000

-

$7.850

$7.025

$6.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,071 parts In-Stock

1+ parts

$6.450

100+ parts

-

1k+ parts

-

10k+ parts

-

2,071

$6.450

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

$10.931

100+ parts

$4.737

1k+ parts

$4.482

10k+ parts

-

250

$10.931

$4.737

$4.482

-

Vyrian

USA . 3,598 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,598

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Dan-Mar Components

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 524 parts In-Stock

1+ parts

$0.755

100+ parts

-

1k+ parts

-

10k+ parts

-

524

$0.755

-

-

-

Northwest PG Solutions

USA . 444 parts In-Stock

1+ parts

$0.831

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$0.831

-

-

-

Corphita

USA . 4,548 parts In-Stock

1+ parts

$6.111

100+ parts

-

1k+ parts

-

10k+ parts

-

4,548

$6.111

-

-

-

Component Stockers USA

USA . 5,031 parts In-Stock

1+ parts

$6.870

100+ parts

$5.180

1k+ parts

$5.840

10k+ parts

-

5,031

$6.870

$5.180

$5.840

-

Parana Technologies

USA . 653 parts In-Stock

1+ parts

$21.849

100+ parts

-

1k+ parts

$22.333

10k+ parts

-

653

$21.849

-

$22.333

-

DigiPath Technology Company

USA . 1,069 parts In-Stock

1+ parts

$24.058

100+ parts

$22.133

1k+ parts

-

10k+ parts

-

1,069

$24.058

$22.133

-

-

ChromeModa Solutions

Germany . 6,347 parts In-Stock

1+ parts

$24.549

100+ parts

$20.130

1k+ parts

-

10k+ parts

-

6,347

$24.549

$20.130

-

-

IDEA Electronic Components Group

UK . 753 parts In-Stock

1+ parts

$24.549

100+ parts

$23.322

1k+ parts

$22.094

10k+ parts

-

753

$24.549

$23.322

$22.094

-

Overview

Elevate your power management solutions with the BQ24270RGET by Texas Instruments. Renowned for their top-notch quality and innovation, Texas Instruments delivers cutting-edge Power Management ICs that are ideal for a wide range of applications. With a sleek design and advanced features, this product offers unmatched value and benefits to customers looking for reliable and efficient power supply management circuits. Upgrade your systems with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation properties and can help in reducing the overall weight of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on circuit boards, saving time and cost during production.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can handle demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in both cold and hot environments.

Width (mm): 4 mm

With a small width, this IC can fit into compact spaces and contribute to a more streamlined design of the overall product.

Switcher Config: BUCK

The buck configuration is efficient in converting higher voltages to lower, making this IC suitable for power management applications.

Technical Specifications

Power Management ICs BQ24270RGET attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

BQ24270RGET Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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