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BQ24204DGNRG4

Texas Instruments

BQ24204DGNRG4 by Texas Instruments

BQ24204DGNRG4 by Texas Instruments is a Power Management IC with 8 terminals in a small outline package. It operates b/w -40 to 125°C, supporting supply voltages from 2.8V to 13.5V, making it ideal for automotive applications requiring low power consumption and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,940 parts In-Stock

1+ parts

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4,940

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Digiode

USA . 3,364 parts In-Stock

1+ parts

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3,364

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,128 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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1,128

$0.500

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Semicontronic

India . 1,485 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,485

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 232 parts In-Stock

1+ parts

$7.500

100+ parts

-

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232

$7.500

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Parana Technologies

USA . 571 parts In-Stock

1+ parts

$10.789

100+ parts

-

1k+ parts

$11.271

10k+ parts

-

571

$10.789

-

$11.271

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$11.194

100+ parts

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490

$11.194

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DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

$11.880

100+ parts

$10.929

1k+ parts

-

10k+ parts

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402

$11.880

$10.929

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ChromeModa Solutions

Germany . 1,772 parts In-Stock

1+ parts

$12.122

100+ parts

$9.940

1k+ parts

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1,772

$12.122

$9.940

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IDEA Electronic Components Group

UK . 1,755 parts In-Stock

1+ parts

$12.122

100+ parts

$11.516

1k+ parts

$10.910

10k+ parts

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1,755

$12.122

$11.516

$10.910

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Corphita

USA . 3,504 parts In-Stock

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3,504

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Northwest PG Solutions

USA . 1,947 parts In-Stock

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1,947

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Native Components

USA . 377 parts In-Stock

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377

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Microchip USA

USA . 264 parts In-Stock

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264

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Corohmni

South Africa . 80 parts In-Stock

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80

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Overview

Experience the power of innovation with the BQ24204DGNRG4 by Texas Instruments. As a leader in Power Management ICs, Texas Instruments delivers top-quality products that exceed industry standards. This small outline package offers a wide range of applications including power supply support circuits, making it a versatile choice for various projects. With a temperature grade suitable for automotive use and a maximum supply voltage of 13.5V, this product ensures reliable performance in any environment. Trust in Texas Instruments to provide you with the best-in-class solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving valuable space.

Package Shape: SQUARE

The square shape facilitates easy layout on the circuit board and enables efficient use of space.

No. of Terminals: 8

Having multiple terminals allows for more connections and functionality, making the product versatile.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring stable performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that the product can operate effectively in extreme temperatures, enhancing its reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Minimum Supply Voltage (Vsup): 2.8 V

The low minimum supply voltage allows for efficient power management and compatibility with a wide range of devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent requirements for reliability and performance in vehicle systems.

Maximum Supply Current (Isup): 2.5 mA

The low maximum supply current consumption helps in reducing power consumption and increasing efficiency in power management.

Terminal Pitch: 0.65 mm

The small terminal pitch enables compact design and high-density PCB layouts, making the product ideal for space-constrained applications.

Maximum Supply Voltage (Vsup): 13.5 V

With a high maximum supply voltage, this product is suitable for a wide range of power supply applications, providing flexibility and versatility.

Technical Specifications

Power Management ICs BQ24204DGNRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24204DGNRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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