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BQ24202DGNG4

Texas Instruments

BQ24202DGNG4 by Texas Instruments

BQ24202DGNG4 by Texas Instruments is a Power Management IC with 8 terminals, operating temperature range of -40 to 85°C. It supports power supply circuits with a min supply voltage of 2.8V and max of 13.5V. Ideal for industrial applications requiring compact design and high thermal performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,095 parts In-Stock

1+ parts

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8,095

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Digiode

USA . 1,644 parts In-Stock

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1,644

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 231 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

231

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 155 parts In-Stock

1+ parts

$0.500

100+ parts

-

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155

$0.500

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Native Components

USA . 988 parts In-Stock

1+ parts

$0.702

100+ parts

-

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988

$0.702

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Northwest PG Solutions

USA . 2,017 parts In-Stock

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$0.772

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2,017

$0.772

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Parana Technologies

USA . 1,908 parts In-Stock

1+ parts

$5.055

100+ parts

-

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$5.621

10k+ parts

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1,908

$5.055

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$5.621

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DigiPath Technology Company

USA . 1,881 parts In-Stock

1+ parts

$5.566

100+ parts

$5.121

1k+ parts

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1,881

$5.566

$5.121

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ChromeModa Solutions

Germany . 6,637 parts In-Stock

1+ parts

$5.680

100+ parts

$4.658

1k+ parts

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6,637

$5.680

$4.658

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IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$5.680

100+ parts

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$5.112

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387

$5.680

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$5.112

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AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$13.680

100+ parts

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860

$13.680

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Microchip USA

USA . 2,084 parts In-Stock

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2,084

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Corphita

USA . 1,096 parts In-Stock

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1,096

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Corohmni

South Africa . 161 parts In-Stock

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161

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Overview

Experience the power of innovation with the BQ24202DGNG4 by Texas Instruments, a leading manufacturer in the industry of Power Management ICs. This versatile device offers a wide range of applications and benefits, making it a must-have for any project requiring efficient power supply support. With its high-quality materials and advanced technology, this small outline, heat sink package provides customers with a reliable solution that ensures optimal performance in industrial-grade environments. Upgrade your systems with the BQ24202DGNG4 and enjoy the advantage of superior quality and value that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal insulation and electrical insulation properties, making the product durable and reliable.

Surface Mount: YES

Surface mount technology simplifies the assembly process and reduces the overall size of the product, making it ideal for space-constrained applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows for use in both extreme hot and cold conditions, increasing versatility of the product.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent corrosion resistance and ensures reliable electrical connections for long-term use.

Width (mm): 3 mm

Compact width size makes the product suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage requirement allows for operation in low power scenarios, making it energy efficient.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the reflow soldering process without damage.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can operate reliably in harsh industrial environments with varying temperature conditions.

Technical Specifications

Power Management ICs BQ24202DGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24202DGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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