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BQ24201DGNR

Texas Instruments

BQ24201DGNR by Texas Instruments

BQ24201DGNR by Texas Instruments is a Power Management IC with 8 terminals, operating temperature range of -40 to 125°C. It supports power supply circuits, suitable for automotive applications due to its small size and low supply current of 2.5mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,977 parts In-Stock

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2,977

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Vyrian

USA . 2,631 parts In-Stock

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2,631

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Distributors (Availability)

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Native Components

USA . 103 parts In-Stock

1+ parts

$0.415

100+ parts

-

1k+ parts

-

10k+ parts

$0.398

103

$0.415

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-

$0.398

Northwest PG Solutions

USA . 1,616 parts In-Stock

1+ parts

$0.456

100+ parts

-

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$0.403

1,616

$0.456

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$0.403

Ampacity Inc.

Singapore . 1,592 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,592

$3.500

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Semicontronic

India . 774 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

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774

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 1,358 parts In-Stock

1+ parts

$5.500

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1,358

$5.500

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Parana Technologies

USA . 1,258 parts In-Stock

1+ parts

$7.383

100+ parts

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$7.875

10k+ parts

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1,258

$7.383

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$7.875

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DigiPath Technology Company

USA . 1,810 parts In-Stock

1+ parts

$8.129

100+ parts

$7.479

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1,810

$8.129

$7.479

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ChromeModa Solutions

Germany . 3,356 parts In-Stock

1+ parts

$8.295

100+ parts

$6.802

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3,356

$8.295

$6.802

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IDEA Electronic Components Group

UK . 385 parts In-Stock

1+ parts

$8.295

100+ parts

$7.880

1k+ parts

$7.466

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385

$8.295

$7.880

$7.466

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AZTECH Wire

Italy . 421 parts In-Stock

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$8.819

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421

$8.819

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Corphita

USA . 873 parts In-Stock

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Corohmni

South Africa . 491 parts In-Stock

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Microchip USA

USA . 236 parts In-Stock

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236

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Overview

Elevate your power management game with the BQ24201DGNR by Texas Instruments. This high-quality Power Management IC is designed to optimize performance and efficiency in a variety of applications. With Texas Instruments' reputation for top-notch manufacturing, you can trust that this product delivers on reliability and durability. Whether you're working on automotive projects or other electronic devices, the BQ24201DGNR offers exceptional value with its advanced features and benefits. Say goodbye to power supply issues and hello to seamless functionality with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easier to handle and manufacture.

Surface Mount: YES

Ease of installation and space-saving on PCBs, ideal for compact electronic devices.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easier integration in designs.

No. of Terminals: 8

Sufficient terminals for connecting different components, providing versatility in applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

These features enhance thermal dissipation, reduce space requirements, and improve overall performance.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures ensures reliability and stability under varying conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme environments without compromising performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connectivity options.

Maximum Seated Height: 1.07 mm

Low profile design helps in minimizing overall height of the product assembly.

Width (mm): 3 mm

Compact width enables installation in space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Important feature for providing stable power supply and voltage regulation in electronic systems.

Minimum Supply Voltage (Vsup): 2.8 V

Supports operation at low supply voltages for energy efficiency and battery-powered applications.

Length: 3 mm

Uniform dimensions provide uniformity in layout and easier integration into designs.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications requiring high temperature tolerance and reliability.

Maximum Supply Current (Isup): 2.5 mA

Low supply current consumption for efficient power management in electronic systems.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and secure soldering connections.

Terminal Pitch: 0.65 mm

Fine pitch terminals enable high-density mounting on PCBs for compact designs.

Maximum Supply Voltage (Vsup): 13.5 V

Supports operation at higher supply voltages, ideal for applications requiring higher power levels.

Technical Specifications

Power Management ICs BQ24201DGNR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24201DGNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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