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BQ24167RGER

Texas Instruments

BQ24167RGER by Texas Instruments

BQ24167RGER by Texas Instruments is a Power Management IC with 24 terminals in a square package. It operates b/w -40 to 85°C, supporting supply voltages from 4.2V to 10V. This chip carrier is ideal for industrial applications requiring a buck switcher configuration and adjustable threshold settings.

Median Price

$7.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,871 parts In-Stock

1+ parts

$5.040

100+ parts

$4.940

1k+ parts

$4.840

10k+ parts

-

1,871

$5.040

$4.940

$4.840

-

Texas Instruments

USA . 3,000 parts In-Stock

1+ parts

$9.599

100+ parts

$8.411

1k+ parts

$4.752

10k+ parts

-

3,000

$9.599

$8.411

$4.752

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,060 parts In-Stock

1+ parts

$9.119

100+ parts

-

1k+ parts

-

10k+ parts

-

4,060

$9.119

-

-

-

Vyrian

USA . 5,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,883

-

-

-

-

Chip Stock

USA . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

135

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,800 parts In-Stock

1+ parts

$8.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

$8.160

-

-

-

Semicontronic

India . 2,752 parts In-Stock

1+ parts

$8.160

100+ parts

$7.956

1k+ parts

$7.915

10k+ parts

-

2,752

$8.160

$7.956

$7.915

-

Corphita

USA . 599 parts In-Stock

1+ parts

$8.639

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$8.639

-

-

-

AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$8.950

100+ parts

-

1k+ parts

-

10k+ parts

-

711

$8.950

-

-

-

Corohmni

South Africa . 422 parts In-Stock

1+ parts

$9.599

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$9.599

-

-

-

Parana Technologies

USA . 905 parts In-Stock

1+ parts

$11.580

100+ parts

-

1k+ parts

$11.986

10k+ parts

-

905

$11.580

-

$11.986

-

DigiPath Technology Company

USA . 1,290 parts In-Stock

1+ parts

$12.751

100+ parts

$11.731

1k+ parts

-

10k+ parts

-

1,290

$12.751

$11.731

-

-

IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$13.011

100+ parts

$12.360

1k+ parts

$11.710

10k+ parts

-

1,739

$13.011

$12.360

$11.710

-

ChromeModa Solutions

Germany . 1,498 parts In-Stock

1+ parts

$13.011

100+ parts

$10.669

1k+ parts

-

10k+ parts

-

1,498

$13.011

$10.669

-

-

Kepictronics

USA . 5,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,230

-

-

-

-

Northwest PG Solutions

USA . 2,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.204

10k+ parts

-

2,230

-

-

$4.204

-

Native Components

USA . 335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.161

10k+ parts

-

335

-

-

$4.161

-

Overview

Elevate your power management game with the BQ24167RGER by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a cutting-edge Power Management IC that is perfect for a wide range of applications. With its advanced features and innovative design, this product offers unmatched value, benefits, and advantages to customers looking for efficient and reliable power solutions. Say goodbye to downtime and hello to seamless performance with the BQ24167RGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of cost-effectiveness and durability, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space in the final product.

Package Shape: SQUARE

The square shape helps to optimize space utilization on the circuit board, especially in compact designs.

No. of Terminals: 24

Having multiple terminals allows for greater connectivity options and versatility in the product's applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability in electrical connections.

Terminal Position: QUAD

The quad terminal position provides more connection points, enabling greater flexibility in circuit design and functionality.

Width (mm): 4 mm

The compact width allows for efficient use of space on the circuit board, especially in small form factor devices.

Switcher Config: BUCK

The buck switching configuration is efficient for step-down voltage regulation, making the product suitable for power supply support circuits.

Technical Specifications

Power Management ICs BQ24167RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

BQ24167RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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