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BQ24159YFFT

Texas Instruments

BQ24159YFFT by Texas Instruments

BQ24159YFFT by Texas Instruments is a Power Management IC with 20 terminals, supporting a supply voltage range of 4-9V. It features a BUCK switcher configuration, adjustable threshold, and operates in industrial temperature grades. Ideal for applications requiring precise power supply support circuits in compact spaces.

Median Price

$4.082

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,700 parts In-Stock

1+ parts

$5.046

100+ parts

$4.421

1k+ parts

$2.498

10k+ parts

-

13,700

$5.046

$4.421

$2.498

-

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$3.180

1k+ parts

$2.850

10k+ parts

$2.680

750

-

$3.180

$2.850

$2.680

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$4.190

1k+ parts

-

10k+ parts

-

750

-

$4.190

-

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$3.975

1k+ parts

$3.563

10k+ parts

$3.350

750

-

$3.975

$3.563

$3.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,480 parts In-Stock

1+ parts

$3.296

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

$3.296

-

-

-

Vyrian

USA . 7,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,370

-

-

-

-

DigiKey Marketplace

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 577 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

-

577

$0.580

-

-

-

Northwest PG Solutions

USA . 648 parts In-Stock

1+ parts

$0.638

100+ parts

-

1k+ parts

-

10k+ parts

-

648

$0.638

-

-

-

Ampacity Inc.

Singapore . 4,880 parts In-Stock

1+ parts

$2.950

100+ parts

-

1k+ parts

-

10k+ parts

-

4,880

$2.950

-

-

-

Corphita

USA . 3,456 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

-

10k+ parts

-

3,456

$3.123

-

-

-

Component Stockers USA

USA . 12,478 parts In-Stock

1+ parts

$3.590

100+ parts

$3.380

1k+ parts

$2.710

10k+ parts

$2.710

12,478

$3.590

$3.380

$2.710

$2.710

Parana Technologies

USA . 198 parts In-Stock

1+ parts

$21.920

100+ parts

-

1k+ parts

$22.423

10k+ parts

-

198

$21.920

-

$22.423

-

ChromeModa Solutions

Germany . 5,471 parts In-Stock

1+ parts

$24.629

100+ parts

$20.196

1k+ parts

-

10k+ parts

-

5,471

$24.629

$20.196

-

-

IDEA Electronic Components Group

UK . 2,249 parts In-Stock

1+ parts

$24.629

100+ parts

$23.398

1k+ parts

$22.166

10k+ parts

-

2,249

$24.629

$23.398

$22.166

-

Microchip USA

USA . 1,542 parts In-Stock

1+ parts

$30.340

100+ parts

$30.150

1k+ parts

$30.060

10k+ parts

$29.970

1,542

$30.340

$30.150

$30.060

$29.970

DigiPath Technology Company

USA . 1,222 parts In-Stock

1+ parts

-

100+ parts

$22.206

1k+ parts

-

10k+ parts

-

1,222

-

$22.206

-

-

Overview

Experience unparalleled power management with the BQ24159YFFT by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The BQ24159YFFT falls under the Power Management ICs category and is perfect for a wide range of applications. With a compact rectangular package shape and surface mount design, this product offers exceptional value and benefits to customers looking for efficient power supply support circuits. Trust Texas Instruments for superior performance and innovative solutions for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space on the circuit board, allowing for more compact and streamlined designs.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V is a common and widely used voltage level, making this product compatible with a wide range of applications.

No. of Terminals: 20

Having 20 terminals allows for a high level of connectivity and flexibility in designing power management circuits.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch allows for high-density mounting of components, saving space on the circuit board.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can operate in cold environments and withstand temperature fluctuations.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easy soldering and connection to the circuit board, simplifying the assembly process.

Maximum Seated Height: 0.625 mm

With a maximum seated height of 0.625 mm, this product has a low profile, which is beneficial for applications where space is limited.

Width (mm): 2 mm

The narrow width of 2 mm allows for efficient use of space on the circuit board, enabling compact and space-saving designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product is designed to enhance the performance and reliability of power management systems, making it a valuable component in such applications.

Minimum Supply Voltage (Vsup): 4 V

With a minimum supply voltage of 4V, this product can operate efficiently even at low voltage levels, expanding its compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during the assembly process, contributing to the overall quality of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature reflow soldering processes without compromising its performance.

Length: 2.14 mm

The length of 2.14 mm is compact, allowing for space-efficient placement on the circuit board and enabling sleek and streamlined designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures reliable operation in harsh or demanding environments, making it suitable for industrial applications.

Terminal Form: BALL

The terminal form of balls provides good mechanical strength and reliability in the connection, ensuring stable performance under varying conditions.

Switcher Config: BUCK

Having a buck switcher configuration allows for efficient voltage conversion with high efficiency, making this product suitable for power management applications that require step-down voltage regulation.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, this product enables high-density mounting of components on the circuit board, contributing to compact and space-saving designs.

Maximum Supply Voltage (Vsup): 9 V

With a maximum supply voltage of 9V, this product can handle higher voltage levels, providing flexibility and compatibility with a wide range of power sources.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization of the operating parameters, providing flexibility in adapting the product to different power management requirements.

Technical Specifications

Power Management ICs BQ24159YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B20

JESD-609 Code:

e1

Length:

2.14 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

BQ24159YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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