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BQ24120RHLRG4

Texas Instruments

BQ24120RHLRG4 by Texas Instruments

BQ24120RHLRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating from -40 to 85°C. It supports supply voltage range of 4.35-16V and has a max current of 5mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,905 parts In-Stock

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6,905

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Chip Stock

USA . 3,233 parts In-Stock

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3,233

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Digiode

USA . 2,395 parts In-Stock

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2,395

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Distributors (Availability)

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Semicontronic

India . 1,636 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,636

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 190 parts In-Stock

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$1.500

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190

$1.500

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One Stop Electronics

USA . 299 parts In-Stock

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$4.500

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299

$4.500

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Parana Technologies

USA . 25 parts In-Stock

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$12.324

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$12.754

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25

$12.324

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$12.754

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AZTECH Wire

Italy . 478 parts In-Stock

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$12.758

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478

$12.758

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DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$13.570

100+ parts

$12.484

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1,507

$13.570

$12.484

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ChromeModa Solutions

Germany . 4,188 parts In-Stock

1+ parts

$13.847

100+ parts

$11.355

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4,188

$13.847

$11.355

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IDEA Electronic Components Group

UK . 1,593 parts In-Stock

1+ parts

$13.847

100+ parts

$13.155

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$12.462

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1,593

$13.847

$13.155

$12.462

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Advanced Electronics

New Zealand . 1,200 parts In-Stock

1+ parts

$27.254

100+ parts

$26.982

1k+ parts

$25.891

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1,200

$27.254

$26.982

$25.891

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A-Z Elektronik GmbH

Germany . 5,262 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,508 parts In-Stock

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Corphita

USA . 2,091 parts In-Stock

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Microchip USA

USA . 2,038 parts In-Stock

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Northwest PG Solutions

USA . 1,508 parts In-Stock

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Native Components

USA . 831 parts In-Stock

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831

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Kepictronics

USA . 500 parts In-Stock

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500

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Corohmni

South Africa . 466 parts In-Stock

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466

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Overview

Power up your devices with the BQ24120RHLRG4 by Texas Instruments, a leading manufacturer in Power Management ICs. This high-quality product offers efficient power supply support for a wide range of applications. With its advanced features and innovative design, this chip carrier ensures reliable performance and durability. Say goodbye to low battery anxiety and experience the convenience and peace of mind that the BQ24120RHLRG4 brings to your devices. Upgrade your power management solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient space utilization on the circuit board.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers thermal management benefits and space-saving design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance under varying conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position enables stable and secure connections.

Maximum Seated Height: 1 mm

Low seated height aids in compact and slim device designs.

Width (mm): 3.5 mm

Narrow width allows for space-efficient placement on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit makes this IC versatile for various power management applications.

Minimum Supply Voltage (Vsup): 4.35 V

Low minimum supply voltage requirement makes it suitable for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering.

Length: 4.5 mm

Short length contributes to a compact overall design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Supply Current (Isup): 5 mA

Low maximum supply current consumption helps in energy-efficient operation.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and offers better reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates moderate sensitivity to moisture exposure.

Maximum Supply Voltage (Vsup): 16 V

High maximum supply voltage support for versatile power input options.

Technical Specifications

Power Management ICs BQ24120RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24120RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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