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BQ24113RHLRG4

Texas Instruments

BQ24113RHLRG4 by Texas Instruments

BQ24113RHLRG4 by Texas Instruments is a Power Management IC with VOLTAGE-MODE control mode, BUCK switcher config, and 1100 kHz max switching frequency. Ideal for industrial applications requiring a 4.5 A max output current and operating temperature range of -40 to 85 °C. Package style is CHIP CARRIER suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,858 parts In-Stock

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USA . 4,280 parts In-Stock

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Digiode

USA . 2,652 parts In-Stock

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2,652

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Distributors (Availability)

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Native Components

USA . 565 parts In-Stock

1+ parts

$0.664

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565

$0.664

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Northwest PG Solutions

USA . 1,573 parts In-Stock

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$0.730

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1,573

$0.730

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Ampacity Inc.

Singapore . 928 parts In-Stock

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$3.500

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$3.500

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One Stop Electronics

USA . 595 parts In-Stock

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$5.500

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$5.500

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Semicontronic

India . 262 parts In-Stock

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$6.500

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$6.338

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$6.305

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262

$6.500

$6.338

$6.305

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Parana Technologies

USA . 7 parts In-Stock

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$16.696

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$16.956

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7

$16.696

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$16.956

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DigiPath Technology Company

USA . 2,243 parts In-Stock

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$18.384

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$16.913

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$18.384

$16.913

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ChromeModa Solutions

Germany . 2,371 parts In-Stock

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$18.759

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$15.382

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$18.759

$15.382

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IDEA Electronic Components Group

UK . 1,117 parts In-Stock

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$18.759

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$17.821

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$16.883

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1,117

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AZTECH Wire

Italy . 562 parts In-Stock

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$19.193

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Kepictronics

USA . 21,460 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,474 parts In-Stock

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Microchip USA

USA . 2,401 parts In-Stock

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Corohmni

South Africa . 244 parts In-Stock

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Overview

Experience superior power management with the BQ24113RHLRG4 from Texas Instruments. This Power Management IC offers unparalleled quality and reliability, backed by the renowned manufacturer's reputation for excellence. Ideal for a wide range of applications, this chip carrier with heat sink/slug package provides efficient voltage-mode control with a pulse width modulation technique, ensuring optimal performance in industrial settings. With a maximum output current of 4.5 A and a wide operating temperature range, the BQ24113RHLRG4 delivers unmatched value and benefits to customers seeking high-quality power supply support circuits. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that helps in reducing overall weight of the product.

Surface Mount: YES

Easier and more efficient assembly onto circuit boards compared to through-hole mounting.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and peripherals.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Control Mode: VOLTAGE-MODE

Precise control over voltage regulation for optimal power management.

Maximum Output Current: 4.5 A

High output current capability for powering multiple devices or components.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique for regulating power output with high precision.

Switcher Config: BUCK

Efficient buck converter configuration for stepping down voltage with minimal power loss.

Technical Specifications

Power Management ICs BQ24113RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

4.35 V

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.5 A

Nominal Output Voltage:

4.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1100 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24113RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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