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BQ24108RHLRG4

Texas Instruments

BQ24108RHLRG4 by Texas Instruments

BQ24108RHLRG4 by Texas Instruments is a Power Management IC with VOLTAGE-MODE control mode, 1100 kHz switching frequency, and 4.5 A output current. It is used in industrial applications for POWER SUPPLY SUPPORT CIRCUITS due to its compact CHIP CARRIER package and wide operating temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,588 parts In-Stock

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Chip Stock

USA . 4,280 parts In-Stock

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4,280

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Digiode

USA . 3,322 parts In-Stock

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3,322

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Distributors (Availability)

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One Stop Electronics

USA . 421 parts In-Stock

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$1.500

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421

$1.500

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Ampacity Inc.

Singapore . 1,217 parts In-Stock

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$4.500

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$4.500

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Semicontronic

India . 174 parts In-Stock

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$4.500

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$4.388

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$4.365

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174

$4.500

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$4.365

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Native Components

USA . 259 parts In-Stock

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$5.110

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259

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AZTECH Wire

Italy . 265 parts In-Stock

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$11.269

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$11.269

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Parana Technologies

USA . 1,798 parts In-Stock

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$19.459

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$19.470

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DigiPath Technology Company

USA . 832 parts In-Stock

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$21.427

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832

$21.427

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ChromeModa Solutions

Germany . 4,200 parts In-Stock

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$21.864

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$17.928

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$21.864

$17.928

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IDEA Electronic Components Group

UK . 1,753 parts In-Stock

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$21.864

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$20.771

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$19.678

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Corphita

USA . 1,443 parts In-Stock

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Microchip USA

USA . 935 parts In-Stock

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Corohmni

South Africa . 448 parts In-Stock

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Northwest PG Solutions

USA . 200 parts In-Stock

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$5.008

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200

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$5.008

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Overview

Experience unparalleled power management capabilities with the BQ24108RHLRG4 by Texas Instruments. Designed with precision and expertise, this Power Management IC offers unmatched reliability and performance in a compact package. Ideal for a variety of applications, this chip carrier is perfect for industrial settings where efficiency and durability are key. With advanced control techniques and a wide operating temperature range, the BQ24108RHLRG4 delivers optimal functionality and peace of mind. Trust Texas Instruments to provide you with the cutting-edge technology you need for your power supply support circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount capability makes it easy to integrate this IC into a circuit board, saving space and reducing assembly time.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, ensuring stable power supply performance in various operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to perform reliably in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function in cold environments without any issues.

Maximum Output Current: 4.5 A

With a high maximum output current, this IC is capable of powering demanding components or circuits effectively.

Switcher Config: BUCK

The buck configuration allows for efficient step-down voltage conversion, making the IC suitable for applications requiring a lower output voltage.

Technical Specifications

Power Management ICs BQ24108RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

4.35 V

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.5 A

Nominal Output Voltage:

4.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1100 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.5 mm

Trade Compliance

BQ24108RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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